A simulation work aiming to study heat transfer coefficient between argon fluid flow and copper plate is carried out based on atomistic-continuum hybrid method. Navier–Stokes equations for continuum domain are solved through the pressure implicit with splitting of operators (PISO) algorithm, and the atom evolution in molecular domain is solved through the Verlet algorithm. The solver is validated by solving Couette flow and heat conduction problems. With both momentum and energy coupling method applied, simulations on convection of argon flows between two parallel plates are performed. The top plate is kept as a constant velocity and has higher temperature, while the lower one, which is modeled with FCC copper lattices, is also fixed but has lower temperature. It is found that the heat transfer between argon fluid flow and copper plate in this situation is much higher than that at macroscopic when the flow is fully developed.
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September 2015
This article was originally published in
Journal of Heat Transfer
Research-Article
Atomistic-Continuum Hybrid Simulation of Heat Transfer Between Argon Flow and Copper Plates
Yijin Mao,
Yijin Mao
Department of Mechanical and
Aerospace Engineering,
Aerospace Engineering,
University of Missouri
,Columbia, MO 65211
Search for other works by this author on:
Yuwen Zhang,
Yuwen Zhang
Department of Mechanical and
Aerospace Engineering,
e-mail: zhangyu@missouri.edu
Aerospace Engineering,
University of Missouri
,Columbia, MO 65211
e-mail: zhangyu@missouri.edu
Search for other works by this author on:
C. L. Chen
C. L. Chen
Department of Mechanical and
Aerospace Engineering,
Aerospace Engineering,
University of Missouri
,Columbia, MO 65211
Search for other works by this author on:
Yijin Mao
Department of Mechanical and
Aerospace Engineering,
Aerospace Engineering,
University of Missouri
,Columbia, MO 65211
Yuwen Zhang
Department of Mechanical and
Aerospace Engineering,
e-mail: zhangyu@missouri.edu
Aerospace Engineering,
University of Missouri
,Columbia, MO 65211
e-mail: zhangyu@missouri.edu
C. L. Chen
Department of Mechanical and
Aerospace Engineering,
Aerospace Engineering,
University of Missouri
,Columbia, MO 65211
Manuscript received April 20, 2014; final manuscript received January 27, 2015; published online May 14, 2015. Assoc. Editor: L. Q. Wang.
J. Heat Transfer. Sep 2015, 137(9): 091011 (7 pages)
Published Online: September 1, 2015
Article history
Received:
April 20, 2014
Revision Received:
January 27, 2015
Online:
May 14, 2015
Citation
Mao, Y., Zhang, Y., and Chen, C. L. (September 1, 2015). "Atomistic-Continuum Hybrid Simulation of Heat Transfer Between Argon Flow and Copper Plates." ASME. J. Heat Transfer. September 2015; 137(9): 091011. https://doi.org/10.1115/1.4030224
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