The one-dimensional (1D) conduction analytical approaches for a semi-infinite domain, widely adopted in the data processing of transient thermal experiments, can lead to large errors, especially near a corner of solid domain. The problems could be addressed by adopting 2D/3D numerical solutions (finite element analysis (FEA) or computational fluid dynamics (CFD)) of the solid field. In addition to needing the access to a conduction solver and extra computing effort, the numerical field solution based processing methods often require extra experimental efforts to obtain full thermal boundary conditions around corners. On a more fundamental note, it would be highly preferable that the experimental data processing is completely free of any numerical solutions and associated discretization errors, not least because it is often the case that the main purposes of many experimental measurements are exactly to validate the numerical solution methods themselves. In the present work, an analytical-solution based method is developed to enable the correction of the 2D conduction errors in a corner region without using any conduction solvers. The new approach is based on the recognition that a temperature time trace in a 2D corner situation is the result of the accumulated heat conductions in both the normal and lateral directions. An equivalent semi-infinite 1D conduction temperature trace for a correct heat transfer coefficient (HTC) can then be generated by reconstructing and removing the lateral conduction component at each time step. It is demonstrated that this simple correction technique enables the use of the standard 1D conduction analysis to get the correct HTC completely analytically without any aid of CFD or FEA solutions. In addition to a transient infrared (IR) thermal measurement case, two numerical test cases of practical interest with turbine blade tip heat transfer and film cooling are used for validation and demonstration. It has been consistently shown that the errors of the conventional 1D conduction analysis in the near corner regions can be greatly reduced by the new corner correction method.
Analytical-Solution Based Corner Correction for Transient Thermal Measurement
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received July 15, 2014; final manuscript received May 17, 2015; published online August 4, 2015. Assoc. Editor: Danesh / D. K. Tafti.
- Views Icon Views
- Share Icon Share
- Cite Icon Cite
- Search Site
Jiang, H., Chen, W., Zhang, Q., and He, L. (August 4, 2015). "Analytical-Solution Based Corner Correction for Transient Thermal Measurement." ASME. J. Heat Transfer. November 2015; 137(11): 111302. https://doi.org/10.1115/1.4030980
Download citation file:
- Ris (Zotero)
- Reference Manager