Cold aisle containment is used in raised floor, air cooled data centers to minimize direct mixing between the supplied cold air and the hot air exiting from the servers. The objective of such a system is to minimize the server inlet air temperatures. In this paper, large scale air temperature field measurements are performed to investigate the hot air entrainment characteristics in the cold aisle in both open and contained aisle conditions. Both under-provisioned and over-provisioned scenarios were examined. Thermal field measurements suggest significant improvement in the cold air delivery for the case with contained aisle as compared to open aisle. Even for an over-provisioned case with open aisle, hot air entrainment was observed from the aisle entrance; however, for the contained aisle condition, close to perfect cold air delivery to the racks was observed. For both under-provisioned and over-provisioned cases, the aisle containment tended to equalize the tile and rack air flow rates. Balance air is expected to be leaked into or out of the containment to makeup the flow rate difference for the contained aisle condition. The CFD modeling strategy at the aisle level is also discussed for open aisle condition. Our previous investigation for rack level modeling has shown that consideration of momentum rise above the tile surface improves the predictive capability as compared to the generally used porous jump model. The porous jump model only specifies a step pressure loss at the tile surface without any influence on flow field. The momentum rise above the tile surface was included using a modified body force model by artificially specifying a momentum source above the tile surface. The modified body force model suggested higher air entrainment and higher reach of cold air as compared to the porous jump model. The modified body force model was able to better capture hot air entrainment through aisle entrance and compared well with the experimental data for the end racks. The generally used porous jump model suggested lower hot air entrainment and under predicted the server inlet temperatures for end racks.

References

References
1.
Joshi
,
Y.
, and
Kumar
,
P.
,
2012
,
Energy Efficient Thermal Management of Data Centers
,
Springer
,
New York
.
2.
Schmidt
,
R.
,
Vallury
,
A.
, and
Iyengar
,
M.
,
2011
, “
Energy Savings Through Hot and Cold Aisle Containment Configurations for Air Cooled Servers in Data Centers
,”
Proceedings of the Pacific Rim Technical Conference and Exposition on Packaging and Integration of Electronic and Photonic Systems
(
InterPACK
),
Portland
,
OR
,
July 6–8
.10.1115/IPACK2011-52206
3.
ASHRAE
,
2011
,
ASHRAE TC 9.9
, “
Thermal Guidelines for Data Processing Environments—Expanded Data Center Classes and Usage Guidance
,”
ASHRAE
, Atlanta, GA.
4.
Shrivastava
,
S. K.
,
Calder
,
A. R.
, and
Ibrahim
,
M.
,
2012
, “
Quantitative Comparison of Air Containment Systems
,”
Proceedings of the Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
(
ITherm
),
San Diego
,
CA
,
May 30–June 1
10.1109/ITHERM.2012.6231415
5.
Takahashi
,
M.
,
Uekusa
,
T.
,
Kishita
,
M.
, and
Kaneko
,
H.
,
2008
, “
Aisle-Capping Method for Airflow Design in Data Centers
,”
Proceedings of the International Telecommunications Energy Conference
(
INTELEC
),
San Diego
,
CA
,
Sept. 14–18
.10.1109/INTLEC.2008.4664047
6.
Gondipalli
,
S.
,
Sammakia
,
B.
,
Bhopte
,
S.
,
Schmidt
,
R.
,
Iyengar
,
M. K.
, and
Murray
,
B.
,
2009
, “
Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits
,”
Proceedings of the Pacific Rim Technical Conference and Exposition on Packaging and Integration of Electronic and Photonic Systems
(
InterPACK
),
San Francisco
,
CA
,
July 19–23
.10.1115/InterPACK2009-89203
7.
Gondipalli
,
S.
,
Bhopte
,
S.
,
Sammakia
,
B.
,
Iyengar
,
M. K.
, and
Schmidt
,
R.
,
2008
, “
Effect of Isolating Cold Aisles on Rack Inlet Temperature
,”
Proceedings of the Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
(
ITherm
),
Orlando
,
FL
,
May 28–31
10.1109/ITHERM.2008.4544403.
8.
Arghode
,
V. K.
,
Kumar
,
P.
,
Joshi
,
Y.
,
Weiss
,
T.
, and
Meyer
,
G.
,
2012
, “
Rack Level Modeling of Air Flow Through Perforated Tile in a Data Center
,”
J. Electron. Packag.
(submitted).
9.
Abdelmaksoud
,
W. A.
,
Khalifa
,
H. E.
,
Dang
,
T. Q.
,
Elhadidi
,
B.
,
Schmidt
,
R. R.
, and
Iyengar
,
M.
,
2010
, “
Experimental and Computational Study of Perforated Floor Tile in Data Centers
,”
Proceedings of the Intersociety Conference on Thermal Phenomena
(ITherm)
,
Las Vegas
,
NV
,
June 2–5
.10.1109/ITHERM.2010.5501413
10.
Shortridge Instruments, Inc.
,
2013
, “
Shortridge Instruments, Inc.
,” http://www.shortridge.com/
11.
Patankar
,
S. V.
,
1980
,
Numerical Heat Transfer and Fluid Flow
,
Hemisphere
,
New York
.
12.
Freid
,
E.
, and
Idelchik
,
I. E.
,
1989
,
Flow Resistance: A Design Guide for Engineers
,
Hemisphere
,
New York
.
13.
Arghode
,
V. K.
, and
Joshi
,
Y.
,
2012
, “
Modeling Strategies for Air Flow Through Perforated Tiles in a Data Center
,”
Trans. Compon., Packag. Manuf. Technol.
(accepted).
You do not currently have access to this content.