Heterogeneous materials are becoming more common in a wide range of functional devices, particularly those involving energy transport, conversion, and storage. Often, heterogeneous materials are crucial to the performance and economic scalability of such devices. Heterogeneous materials with inherently random structures exhibit a strong sensitivity of energy transport properties to processing and operating conditions. Therefore, improved predictive modeling capabilities are needed that quantify the detailed microstructure of such materials based on various manufacturing processes and correlate them with transport properties. In this work, we integrate high fidelity microstructural and transport models, which can aid in the development of high performance energy materials. Heterogeneous materials are generally comprised of nanometric or larger length scale domains of different materials or different phases of the same material. State-of-the-art structural optimization models demonstrate the predictability of the microstructure for heterogeneous materials manufactured via powder compaction of variously shaped and sized particles. The ability of existing diffusion models to incorporate the essential multiscale features in random microstructures is assessed. Lastly, a comprehensive approach is presented for the combined modeling of a high fidelity microstructure and heat transport therein. Exemplary results are given that reinforce the importance of developing predictive models with rich stochastic output that connect microstructural information with physical transport properties.
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Combined Microstructure and Heat Conduction Modeling of Heterogeneous Interfaces and Materials
Ishan Srivastava,
Sridhar Sadasivam,
Kyle C. Smith,
Timothy S. Fisher
Timothy S. Fisher
e-mail: tsfisher@purdue.edu
Birck Nanotechnology Center and School of Mechanical Engineering
,Purdue University
,West Lafayette, IN 47906
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Ishan Srivastava
e-mail: isrivast@purdue.edu
Sridhar Sadasivam
e-mail: ssadasi@purdue.edu
Kyle C. Smith
e-mail: kyle.c.smith@gmail.com
Timothy S. Fisher
e-mail: tsfisher@purdue.edu
Birck Nanotechnology Center and School of Mechanical Engineering
,Purdue University
,West Lafayette, IN 47906
Manuscript received October 15, 2012; final manuscript received December 19, 2012; published online May 16, 2013. Assoc. Editor: Leslie Phinney.
J. Heat Transfer. Jun 2013, 135(6): 061603 (13 pages)
Published Online: May 16, 2013
Article history
Received:
October 15, 2012
Revision Received:
December 19, 2012
Citation
Srivastava, I., Sadasivam, S., Smith, K. C., and Fisher, T. S. (May 16, 2013). "Combined Microstructure and Heat Conduction Modeling of Heterogeneous Interfaces and Materials." ASME. J. Heat Transfer. June 2013; 135(6): 061603. https://doi.org/10.1115/1.4023583
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