With many emerging capabilities in pervasive computing, internet access, wireless communication, and data processing, the smartphone with high central processing unit (CPU) frequency is achieving extremely high running speed which also brings about discomfort to the users due to huge heat released. Here, an automatic temperature regulation strategy using low melting point metal gallium to absorb transitory heat was proposed for the first time. Experiments demonstrate that 3.4125 ml gallium would maintain the module below 45 °C for 16 min at 2.832 W. Such temperature holding time was longer than most of the conventional phase change materials (PCMs). Moreover, some interesting phase change phenomena were also discovered such that mixing SiO2 powder with gallium or just shaking the liquid metal container will help reduce the large supercooling of gallium which is beneficial for the material to quickly recover to its original service state again. The method is expected to be very useful and efficient in maintaining thermal comfort of many handheld electronics, especially for the burgeoning smartphones and panel personal computer (PPC).

References

References
1.
Luo
,
Z.
,
Cho
,
H.
,
Luo
,
X.
, and
Cho
,
K.
,
2008
, “
System Thermal Analysis for Mobile Phone
,”
Appl. Therm. Eng.
,
28
, pp.
1889
1895
.10.1016/j.applthermaleng.2007.11.025
2.
Kandasamy
,
R.
,
Wang
,
X. Q.
, and
Mujumdar
,
A. S.
,
2007
, “
Application of Phase Change Materials in Thermal Management of Electronics
,”
Appl. Therm. Eng.
,
27
, pp.
2822
2832
.10.1016/j.applthermaleng.2006.12.013
3.
Tan
,
F. L.
, and
Tso
,
C. P.
,
2004
, “
Cooling of Mobile Electronic Devices Using Phase Change Materials
,”
Appl. Therm. Eng.
,
24
, pp.
159
169
.10.1016/j.applthermaleng.2003.09.005
4.
Shen
,
W. J.
, and
Tan
,
F. L.
,
2010
, “
Thermal Management of Mobile Devices
,”
Therm. Sci.
,
14
, pp.
115
124
.10.2298/TSCI1001115S
5.
Salyer
,
I. O.
, and
Sircar
,
A. K.
,
1990
, “
Phase Change Materials for Heating and Cooling of Residential Buildings and Other Applications
,”
Proceedings of the 25th Intersociety Energy Conversion Engineering Conference
(
IECEC
),
Reno, NV
, pp.
236
243
.10.1109/IECEC.1990.716495
6.
Zalba
,
B.
,
Marin
,
J. M.
,
Cabeza
,
L. F.
, and
Mehling
,
H.
,
2003
, “
Review on Thermal Energy Storage With Phase Change: Materials, Heat Transfer Analysis and Applications
,”
Appl. Therm. Eng.
,
23
, pp.
251
283
.10.1016/S1359-4311(02)00192-8
7.
Sheka
,
I. A.
,
Chaus
,
J. S.
, and
Mityureva
,
T. T.
,
1966
,
The Chemistry of Gallium
,
Elsevier
,
Amsterdam
.
8.
Deng
,
Y. G.
, and
Liu
,
J.
,
2009
, “
Corrosion Development Between Liquid Gallium and Four Typical Metal Substrates Used in Chip Cooling Device
,”
Appl. Phys. A
,
95
, pp.
907
915
.10.1007/s00339-009-5098-1
9.
Ma
,
K. Q.
, and
Liu
,
J.
,
2007
, “
Nano Liquid-Metal Fluid as Ultimate Coolant
,”
Phys. Lett. A
,
361
, pp.
252
256
.10.1016/j.physleta.2006.09.041
10.
Archer
,
D. G.
,
2002
, “
The Enthalpy of Fusion of Gallium
,”
J. Chem. Eng. Data
,
47
, pp.
304
309
.10.1021/je015532p
11.
Abhat
,
A.
,
1983
, “
Low Temperature Latent Heat Thermal Energy Storage: Heat Storage Materials
,”
Sol. Energy
,
30
, pp.
313
332
.10.1016/0038-092X(83)90186-X
12.
Biswas
,
D. R.
,
1977
, “
Thermal Energy Storage Using Sodium Sulfate Decahydrate and Water
,”
Sol. Energy
,
19
, pp.
99
100
.10.1016/0038-092X(77)90094-9
13.
Fok
,
S. C.
,
Shen
,
W.
, and
Tan
,
F. L.
,
2010
, “
Cooling of Portable Hand-Held Electronic Devices Using Phase Change Materials in Finned Heat Sinks
,”
Int. J. Therm. Sci.
,
49
, pp.
109
117
.10.1016/j.ijthermalsci.2009.06.011
14.
Genovese
,
A.
,
Amarasinghe
,
G.
,
Glewis
,
M.
,
Mainwaring
,
D.
, and
Shanks
,
R. A.
,
2006
, “
Crystallisation, Melting, Recrystallisation and Polymorphism of N-eicosane for Application as a Phase Change Material
,”
Thermochim. Acta
,
443
, pp.
235
244
.10.1016/j.tca.2006.02.008
15.
Inaba
,
H.
, and
Tu
,
P.
,
1997
, “
Evaluation of Thermophysical Characteristics on Shape-Stabilized Paraffin as a Solid-Liquid Phase Change Material
,”
Heat Mass Transfer
,
32
, pp.
307
312
.10.1007/s002310050126
16.
Kandasamy
,
R.
,
Wang
,
X. Q.
, and
Mujumdar
,
A. S.
,
2008
, “
Transient Cooling of Electronics Using Phase Change Material (PCM)-Based Heat Sinks
,”
Appl. Therm. Eng.
,
28
, pp.
1047
1057
.10.1016/j.applthermaleng.2007.06.010
17.
Strickland
,
R. F.
,
1968
,
Kinetics and Mechanisms of Crystalization
,
Academic Press
,
London
.
18.
Leoni
,
N.
, and
Amon
,
C. H.
,
1997
, “
Transient Thermal Design of Wearable Computers With Embedded Electronics Using Phase Change Materials
,”
ASME HTD
, Vol.
343
, pp.
49
56
.
19.
Greenspan
,
J. D.
,
Roy
,
E. A.
,
Caldwell
,
P. A.
, and
Farooq
,
N. S.
,
2003
, “
Thermosensory Intensity and Effect Throughout the Perceptible Range
,”
Somatosens Mot Res.
,
21
, pp.
19
26
.10.1080/0899022031000083807
20.
Yang
,
S. M.
, and
Tao
,
W. Q.
,
2007
,
Heat Transfer
, 4th ed.,
Higher Education Press
,
Beijing
, pp.
8
9
, 267–269.
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