A mathematical model predicting heat transfer and film thickness in thin-film region is developed herein. Utilizing dimensionless analysis, analytical solutions have been obtained for heat flux distribution, total heat transfer rate per unit length, location of the maximum heat flux and ratio of conduction thermal resistance to convection thermal resistance in the evaporating film region. These analytical solutions show that the maximum dimensionless heat flux is constant which is independent of the superheat. Maximum total heat transfer rate is determined for a given film region. The ratio of conduction thermal resistance to convection thermal resistance is a function of dimensionless film thickness. This work will lead to a better understanding of heat transfer and fluid flow occurring in the evaporating film region.
Analytical Solutions of Heat Transfer and Film Thickness in Thin-Film Evaporation
Contributed by the Heat Transfer Division of ASME for publication in the Journal of Heat Transfer. Manuscript received December 14, 2011; final manuscript received September 20, 2012; published online February 8, 2013. Assoc. Editor: Bruce L. Drolen.
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Yan, C., and Ma, H. B. (February 8, 2013). "Analytical Solutions of Heat Transfer and Film Thickness in Thin-Film Evaporation." ASME. J. Heat Transfer. March 2013; 135(3): 031501. https://doi.org/10.1115/1.4007856
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