In a discussion initiated by the German Research Foundation (DFG) about cooling of electronics, two aspects turned out to be important: The need for a paradigm shift from an “add on” to an “integrated multidisciplinary” solution and the definition of generic demonstrators for cooling strategies.

References

References
1.
Ellsworth
,
M. J.
, and
Iyengar
,
M. K.
,
2009
, “
Energy Efficiency Analyses and Comparison of Air and Water Cooled High Performance Servers
,” Proc. of the ASME 2009 InterPack Conference, IPACK2009, July 19–23, San Francisco, CA, InterPACK2009-89248.
2.
Wei
,
J.
,
2008
, “
Challenges in Cooling Design of CPU Packages for High-Performance Servers
,”
Heat Transfer Eng.
,
29
(
2
), pp.
178
187
.10.1080/01457630701686727
3.
Cheng
,
L.
, and
Thome
,
J. R.
,
2009
, “
Cooling of Microprocessors Using Flow Boiling of CO2 in a Micro-Evaporator: Preliminary Analysis and Performance Comparison
,”
Appl. Therm. Eng.
,
29
(
11–12
), pp.
2426
2432
.10.1016/j.applthermaleng.2008.12.019
4.
Amon
,
C. H.
,
Yao
,
S.-C.
,
Wu
,
C.-F.
, and
Hsieh
,
C.-C.
,
2005
, “
Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics
,”
ASME J. Heat Transfer
,
127
(
1
), pp.
66
75
.10.1115/1.1839586
5.
Schmidt
,
R.
,
Ellsworth
,
M.
,
Iyengar
,
M.
, and
New
,
G.
,
2009
, “
IBM'S Power6 High Performance Water Cooled Cluster at NCAR: Infrastructure Design
,” Proc. of the ASME 2009 InterPack Conference, IPACK2009, July 19–23, San Francisco, CA, InterPACK2009-89213.
6.
McGlen
,
R. J.
,
Jachuck
,
R.
, and
Lin
,
S.
,
2004
, “
Integrated Thermal Management Techniques for High Power Electronic Devices
,”
Appl. Therm. Eng.
,
24
(
8–9
), pp.
1143
1156
.10.1016/j.applthermaleng.2003.12.029
7.
Ma
,
K.
, and
Liu
,
J.
,
2007
, “
Liquid Metal Cooling in Thermal Management of Computer Chips
,”
Front. Energy Power Eng. China
,
1
, pp.
384
402
.10.1007/s11708-007-0057-3
8.
Ghosh
,
S.
,
Calizo
,
I.
,
Teweldebrhan
,
D.
,
Pokatilov
,
E. P.
,
Nika
,
D. L.
,
Balandin
,
A. A.
,
Bao
,
W.
,
Miao
,
F.
, and
Lau
,
C. N.
,
2008
, “
Extremely High Thermal Conductivity of Graphene: Prospects for Thermal Management Applications in Nanoelectronic Circuits
,”
Appl. Phys. Lett.
,
92
(
15
), p.
151911
.10.1063/1.2907977
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