This paper analyses the heat exchange behavior in systems characterized by Y-shaped fins through a numerical approach based on a CFD software. Starting from individual Y profiles, as optimized in a previous work in relation to the dimensionless conductance and to the performance parameter of efficiency, it has been here investigated the advantage of a modular use of profiles. The analysis has been performed by superimposing some dimensional constraints to make immediately comparable the results obtained in the different configurations faced. Each module considered has a number of fins depending on the angle α between the two arms of the Y profile. This number depends therefore also on the horizontal width occupied by the whole system and it is upperly limited by the value allocated to the best performing individual fin. The results showed a significant increase of the dimensionless conductance and therefore of the exchanged thermal power for those multifin configurations with low values of α. This result validates the new optimization criterion proposed.

1.
Lall
,
P.
,
Pecht
,
M.
, and
Hakim
,
E.
, 1997,
Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach
,
CRC Press
,
Boca Raton, FL
.
2.
Upton
,
T. D.
, and
Watt
,
D. W.
, 1997, “
Experimental Study of Transient Natural Convection in an Inclined Rectangular Enclosure
,”
Int. J. Heat Mass Transfer
0017-9310,
40
(
11
), pp.
2679
2690
.
3.
Jubran
,
B. A.
,
Swiety
,
S. A.
, and
Hamdan
,
M. A.
, 1996, “
Convective Heat Transfer and Pressure Drop Characteristics of Various Array Configurations to Simulate the Cooling of Electronic Modules
,”
Int. J. Heat Mass Transfer
0017-9310,
39
(
16
), pp.
3519
3529
.
4.
Horvat
,
A.
, and
Catton
,
I.
, 2003, “
Numerical Technique for Modeling Conjugate Heat Transfer in an Electronic Device Heat Sink
,”
Int. J. Heat Mass Transfer
0017-9310,
46
(
12
), pp.
2155
2168
.
5.
Kandasamy
,
R.
, and
Subramanyam
,
S.
, 2005, “
Application of Computational Fluid Dynamics Simulation Tools for Thermal Characterization of Electronic Packages
,”
Int. J. Heat Mass Transfer
0017-9310,
15
(
1
),
61
72
.
6.
Bejan
,
A.
, and
Almogbel
,
M.
, 2000, “
Constructal T-Shaped Fins
,”
Int. J. Heat Mass Transfer
0017-9310,
43
, pp.
2101
2115
.
7.
Lorenzini
,
G.
, and
Moretti
,
S.
, 2007, “
A CFD Application to Optimise T-Shaped Fins: Comparisons With Constructal Theory’s Results
,”
ASME J. Electron. Packag.
1043-7398,
129
(
3
), pp.
324
327
.
8.
Lorenzini
,
G.
, and
Moretti
,
S.
, 2007, “
Numerical Analysis on Heat Removal From Y-shaped Fins: Efficiency and Volume Occupied for a New Approach to Performance Optimisation
,”
Int. J. Therm. Sci.
1290-0729,
46
(
6
), pp.
573
579
.
9.
Zdanski
,
P. S. B.
,
Ortega
,
M. A.
,
Fico
,
N. G. C. R.
Jr.
, 2005, “
Heat Transfer Studies in the Flow Over Shallow Cavities
,”
ASME J. Heat Transfer
0022-1481,
127
(
7
), pp.
699
712
2005.
10.
Burgess
,
N. K.
, and
Ligrani
,
P. M.
, 2005, “
Effects of Dimple Depths on Channel Nusselt Numbers and Friction Factors
,”
ASME J. Heat Transfer
0022-1481,
127
(
8
), pp.
839
847
.
11.
Barbosa Saldana
,
J. G.
,
Anand
,
N. K.
,
Sarin
,
V.
, 2005, “
Numerical Simulation of Mixed Convective Flow Over a Three-Dimensional Horizontal Backward Facing Step
,”
ASME J. Heat Transfer
0022-1481,
127
(
9
), pp.
1027
1036
.
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