This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enhancer (TCE), as a means of thermal management of electronic systems. Eicosane is used as PCM, while aluminium pin or plate fins are used as TCE. The test section considered in all cases is a 42×42mm2 base with a TCE height of 25mm⁠. An electrical heater at the heat sink base is used to simulate the heat generation in electronic chips. Various volumetric fractions of TCE in the conglomerate of PCM and TCE are considered. The case with 8% TCE volume fraction was found to have the best thermal performance. With this volume fraction of TCE, the effects of fin dimension and fin shape are also investigated. It is found that a large number of small cross-sectional area fins is preferable. A numerical model is also developed to enable an interpretation of experimental results.

Issue Section:
Technical Briefs
Keywords:
heat sinks, phase change materials, thermal conductivity, heat sink, phase change material, thermal conductivity enhancer
Topics:
Fins, Heat sinks, Phase change materials, Temperature, Thermal conductivity, Heat, Dimensions, Aluminum, Thermal management
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 by American Society of Mechanical Engineers
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