An accurate measurement of the thermophysical properties of freestanding thin films is essential for modeling and predicting thermal performance of microsystems. This paper presents a method for simultaneous measurement of in-plane thermal conductivity and heat capacity of freestanding thin films based on the thermal response to a sinusoidal electric current. An analytical model for the temperature response of a freestanding thin film to a sinusoidal heating current passing through a metal heater patterned on top of the thin film is derived. Freestanding thin-film samples of silicon nitride and nickel titanium (NiTi), a shape memory alloy, are microfabricated and characterized. The thermal conductivity of thin-film NiTi, which increases linearly between 243K and 313K, is 40% lower than the bulk value at room temperature. The heat capacity of NiTi also increases linearly with temperature in the low temperature phase and is nearly constant above 280K. The measurement technique developed in this work is expected to contribute to an accurate thermal property measurement of thin-film materials. Thermophysical measurements on NiTi presented in this work are expected to aid in an accurate thermal modeling of microdevices based on the shape memory effect.

1.
Benard
,
W. L.
,
Kahn
,
H.
,
Heuer
,
A. H.
, and
Huff
,
M.
, 1998, “
Thin-Film Shape Memory Alloy Actuated Micropumps
,”
J. Microelectromech. Syst.
1057-7157,
7
, pp.
245
251
.
2.
Sberveglieri
,
G.
,
Hellmich
,
W.
, and
Müller
,
G.
, 1997, “
Silicon Hotplates for Metal Oxide Gas Sensor Elements
,”
Microsyst. Technol.
0946-7076,
3
, pp.
183
190
.
3.
Eaton
,
W. P.
, and
Smith
,
J. H.
, 1997, “
Micromachined Pressure Sensors: Review and Recent Developments
,”
Smart Mater. Struct.
0964-1726,
6
, pp.
530
539
.
4.
Kohl
,
M.
,
Dittmann
,
D.
,
Quandt
,
E.
,
Winzek
,
B.
,
Miyazaki
,
S.
, and
Allen
,
D. M.
, 1999, “
Shape Memory Microvalves Based on Thin Films or Rolled Sheets
,”
Mater. Sci. Eng., A
0921-5093,
273–275
, pp.
784
788
.
5.
Krulevitch
,
P.
,
Lee
,
A. P.
,
Ramsey
,
P. B.
,
Trevino
,
J. C.
,
Hamilton
,
J.
, and
Northrup
,
M.
, 1996, “
Thin Film Shape-Memory Alloy Micro-Actuators
,”
J. Microelectromech. Syst.
1057-7157,
5
(
4
), pp.
270
282
.
6.
Cahill
,
D. G.
,
Ford
,
W. K.
,
Goodson
,
K. E.
,
Mahan
,
G. D.
,
Majumdar
,
A.
,
Maris
,
H. J.
,
Merlin
,
R.
, and
Phillpot
,
S. R.
, 2003, “
Nanoscale Thermal Transport
,”
J. Appl. Phys.
0021-8979,
93
(
2
), pp.
793
818
.
7.
McConnell
,
A. D.
,
Uma
,
S.
, and
Goodson
,
K. E.
, 2001, “
Thermal Conductivity of Doped Polysilicon Layers
,”
J. Microelectromech. Syst.
1057-7157,
10
(
3
), pp.
360
369
.
8.
Ju
,
Y. S.
, and
Goodson
,
K. E.
, 1999, “
Process-Dependent Thermal Transport Properties of Silicon Dioxide Films Deposited Using Low-Pressure Chemical Vapor Deposition
,”
J. Appl. Phys.
0021-8979,
85
, pp.
7130
7134
.
9.
Goodson
,
K. E.
,
Flik
,
M. I.
,
Su
,
L. T.
, and
Antoniadis
,
D. A.
, 1993, “
Annealing-Temperature Dependence of the Thermal Conductivity of LPCVD Silicon-Dioxide Layers
,”
IEEE Electron Device Lett.
0741-3106,
14
(
10
), pp.
490
492
.
10.
Asheghi
,
M.
,
Touzelbaev
,
M. N.
,
Goodson
,
K. E.
,
Leung
,
Y. K.
, and
Wong
,
S. S.
, 1998, “
Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates
,”
ASME J. Heat Transfer
0022-1481,
120
(
1
), pp.
30
36
.
11.
Cahill
,
D. G.
,
Goodson
,
K. E.
, and
Majumdar
,
A.
, 2002, “
Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures
,”
ASME J. Heat Transfer
0022-1481,
124
(
2
), pp.
223
241
.
12.
Goodson
,
K. E.
, and
Ju
,
Y. S.
, 1999, “
Heat Conduction in Novel Electronic Films
,”
Annu. Rev. Mater. Sci.
0084-6600,
29
, pp.
261
293
.
13.
Paddock
,
C. A.
, and
Eesley
,
G. L.
, 1986, “
Transient Thermoreflectance From Thin Metal Films
,”
J. Appl. Phys.
0021-8979,
60
, pp.
285
290
.
14.
Chu
,
D. C.
,
Touzelbaev
,
M.
,
Goodson
,
K. E.
,
Babin
,
S.
, and
Pease
,
R. F. W.
, 2001, “
Thermal Conductivity Measurements of Thin-Film Resist
,”
J. Vac. Sci. Technol. B
1071-1023,
19
(
6
), pp.
2874
2877
.
15.
Govorkov
,
S.
,
Ruderman
,
W.
,
Horn
,
M. W.
,
Goodman
,
R. B.
, and
Rothschild
,
M.
, 1997, “
A New Method for Measuring Thermal Conductivity of Thin Films
,”
Rev. Sci. Instrum.
0034-6748,
68
(
10
), pp.
3828
3834
.
16.
Rajan
,
M. A. J.
,
Vivekanandam
,
T. S.
,
Ramakrishnan
,
S. K.
,
Ramachandran
,
K.
, and
Umapathy
,
S.
, 2004, “
Heat Transfer in Poly(Methyl Acrylate) by Photoacoustic Measurements
,”
J. Appl. Polym. Sci.
0021-8995,
93
(
3
), pp.
1071
1076
.
17.
Cahill
,
D. G.
, 1990, “
Thermal Conductivity Measurement From 30Kto750K—the 3-Omega Method
,”
Rev. Sci. Instrum.
0034-6748,
61
, pp.
802
808
.
18.
Lee
,
S.-M.
,
Cahill
,
D. G.
, and
Allen
,
T. H.
, 1995, “
Thermal Conductivity of Sputtered Oxide Films
,”
Phys. Rev. B
0163-1829,
52
, pp.
253
257
.
19.
Liu
,
W.
, and
Balandin
,
A. A.
, 2005, “
Thermal Conduction in AlxGa1−xN Alloys and Thin Films
,”
J. Appl. Phys.
0021-8979,
97
, p.
073710
.
20.
Cahill
,
D. G.
,
Katiyar
,
M.
, and
Abelson
,
J. R.
, 1994, “
Thermal Conductivity of a-Si:H Thin Films
,”
Phys. Rev. B
0163-1829,
50
, pp.
6077
6081
.
21.
Kurabayashi
,
K.
,
Asheghi
,
M.
,
Touzelbaev
,
M.
, and
Goodson
,
K. E.
, 1999, “
Measurement of the Thermal Conductivity Anisotropy in Polyimide Films
,”
J. Microelectromech. Syst.
1057-7157,
8
(
2
), pp.
180
191
.
22.
Völkein
,
F.
, and
Baltes
,
H.
, 1992, “
A Microstructure for Measurement of Thermal Conductivity of Polysilicon Thin Films
,”
J. Microelectromech. Syst.
1057-7157,
1
, pp.
193
196
.
23.
Rogers
,
J. A.
,
Yang
,
Y.
, and
Nelson
,
A.
, 1994, “
Elastic Modulus and Inplane Thermal Diffusivity Measurements in Thin Polyimide Films Using Symmetry-Selective Real-Time Impulsive Stimulated Thermal Scattering
,”
Appl. Phys. A: Solids Surf.
0721-7250,
58
, pp.
523
534
.
24.
Fu
,
Y.
,
Du
,
H.
,
Huang
,
W.
,
Zhang
,
S.
, and
Hu
,
M.
, 2004, “
TiNi-Based Thin Films in MEMS Applications: A Review
,”
Sens. Actuators, A
0924-4247,
A112
(
2–3
), pp.
395
408
.
25.
Kahn
,
H.
,
Huff
,
M. A.
, and
Heuer
,
A. H.
, 1998, “
The TiNi Shape-Memory Alloy and Its Applications for MEMS
,”
J. Micromech. Microeng.
0960-1317,
8
, pp.
213
221
.
26.
Reynaerts
,
D.
,
Peirs
,
J.
, and
Van Brussel
,
H.
, 1997, “
An Implantable Drug-Delivery System Based on Shape-Memory Alloy Micro-Actuation
,”
Sens. Actuators, A
0924-4247,
A61
, pp.
455
462
.
27.
Xu
,
W.
,
Frank
,
T. G.
,
Stockham
,
G.
, and
Cuschieri
,
A.
, 1999, “
Shape Memory Alloy Fixator System for Suturing Tissue in Minimal Access Surgery
,”
Ann. Biomed. Eng.
0090-6964,
27
, pp.
663
669
.
28.
Wolf
,
R. H.
, and
Heuer
,
A. H.
, 1995, “
TiNi (Shape Memory) Films on Silicon for MEMS Applications
,”
J. Microelectromech. Syst.
1057-7157,
4
, pp.
206
212
.
29.
Shih
,
C. L.
,
Lai
,
B. K.
,
Kahn
,
H.
,
Philips
,
S. M.
, and
Heuer
,
A. H.
, 2001, “
A Robust Co-Sputtering Fabrication Procedure for TiNi Shape-Memory Alloys for MEMS
,”
J. Microelectromech. Syst.
1057-7157,
10
, pp.
69
79
.
30.
Goff
,
J. F.
, 1964, “
Thermal Conductivity, Thermoelectric Power, and the Electrical Resistivity of Stoichiometric TiNi in the 3to300K Temperature Range
,”
J. Appl. Phys.
0021-8979,
35
, pp.
2919
2927
.
31.
Terada
,
Y.
,
Ohkubo
,
K.
,
Nakagawa
,
K.
,
Mohri
,
T.
, and
Suzuki
,
T.
, 1995, “
Thermal Conductivity of B2-Type Aluminides and Titanides
,”
Intermetallics
0966-9795,
3
, pp.
347
355
.
32.
Faulkner
,
M. G.
,
Amalraj
,
J. J.
, and
Bhattacharyya
,
A.
, 2000, “
Experimental Determination of Thermal and Electrical Properties of Ni-Ti Shape Memory Wires
,”
Smart Mater. Struct.
0964-1726,
9
, pp.
643
639
.
33.
Ju
,
Y. S.
,
Kurabayashi
,
K.
, and
Goodson
,
K. E.
, 1999, “
Thermal Characterization of Anisotropic Thin Dielectric Films Using Harmonic Joule Heating
,”
Thin Solid Films
0040-6090,
339
, pp.
160
164
.
34.
Yang
,
B.
,
Liu
,
W. L.
,
Liu
,
J. L.
,
Wang
,
K. L.
, and
Chen
,
G.
, 2002, “
Measurements of Anisotropic Thermoelectric Properties in Superlattices
,”
Appl. Phys. Lett.
0003-6951,
81
(
19
), pp.
3588
3590
.
35.
Cahill
,
D. G.
, 2002, “
Errata—Thermal Conductivity Measurement From 30Kto750K—The 3-Omega Method
,”
Rev. Sci. Instrum.
0034-6748,
73
(
10
), pp.
3701
3701
.
36.
Jacquot
,
A.
,
Lenoir
,
B.
,
Dauscher
,
A.
,
Stolzer
,
M.
, and
Meusel
,
J.
, 2002, “
Numerical Simulation of the 3ω Method for Measuring the Thermal Conductivity
,”
J. Appl. Phys.
0021-8979,
91
(
7
), pp.
4733
4738
.
37.
Myers
,
G. E.
, 1998,
Analytical Methods in Conduction Heat Transfer
,
2nd ed.
,
AMCHT
,
Madison, WI
.
38.
Mastrangelo
,
C. H.
,
Tai
,
Y.-C.
, and
Muller
,
R. S.
, 1990, “
Thermophysical Properties of Low-Residual Stress, Silicon-Rich, LPCVD Silicon Nitride Films
,”
Sens. Actuators, A
0924-4247,
A21–A23
, pp.
856
860
.
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