Giant magnetoresistance (GMR) head technology is one of the latest advancements in the hard disk drive (HDD) storage industry. The GMR head multilayer structure consists of alternating layers of extremely thin metallic ferromagnetic and nonmagnetic films. A large decrease in the electrical resistivity from antiparallel to parallel alignment of the film magnetizations is observed, known as the GMR effect. The present work characterizes the in-plane electrical and thermal conductivities of GMR multilayer structures in the temperature range of to using Joule-heating and electrical resistance thermometry on suspended bridges. The thermal conductivity of the GMR layer monotonically increases from (at ) to nearly (at room temperature). We also report a GMR ratio of 17% and a large magnetothermal resistance effect (GMTR) of 25% in the multilayer structure.
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Thermal Characterization of Multilayer for Giant Magnetoresistive Head Applications Available to Purchase
Y. Yang,
Y. Yang
Mechanical Engineering Department
Carnegie Mellon University
, Pittsburgh, PA 15213
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R. M. White,
R. M. White
Electrical and Computer Engineering Department
Carnegie Mellon University
, Pittsburgh, PA 15213
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M. Asheghi
M. Asheghi
Mechanical Engineering Department and Electrical and Computer Engineering Department,
Carnegie Mellon University
, Pittsburgh, PA 15213
Search for other works by this author on:
Y. Yang
Mechanical Engineering Department
Carnegie Mellon University
, Pittsburgh, PA 15213
R. M. White
Electrical and Computer Engineering Department
Carnegie Mellon University
, Pittsburgh, PA 15213
M. Asheghi
Mechanical Engineering Department and Electrical and Computer Engineering Department,
Carnegie Mellon University
, Pittsburgh, PA 15213J. Heat Transfer. Feb 2006, 128(2): 113-120 (8 pages)
Published Online: June 21, 2005
Article history
Received:
June 10, 2004
Revised:
June 21, 2005
Citation
Yang, Y., White, R. M., and Asheghi, M. (June 21, 2005). "Thermal Characterization of Multilayer for Giant Magnetoresistive Head Applications." ASME. J. Heat Transfer. February 2006; 128(2): 113–120. https://doi.org/10.1115/1.2136916
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