This paper describes the development of embedded droplet impingement for integrated cooling of electronics (EDIFICE), which seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes over employing latent heat of vaporization of dielectric fluids. Micromanufacturing and microelectromechanical systems are used as enabling technologies for developing innovative cooling schemes. Microspray nozzles are fabricated to produce 50–100 μm droplets coupled with surface texturing on the backside of the chip to promote droplet spreading and effective evaporation. This paper examines jet impingement cooling of EDIFICE with a dielectric coolant and the influence of fluid properties, microspray characteristics, and surface evaporation. The development of micronozzles and microstructured surface texturing is discussed. Results of a prototype testing of swiss-roll swirl nozzles with dielectric fluid HFE-7200 on a notebook PC are presented. This paper also outlines the challenges to practical implementation and future research needs.
Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics
Manuscript received May 14, 2004; revised manuscript received August 13, 2004. Review conducted by: V. Dhir.
- Views Icon Views
- Share Icon Share
- Search Site
Amon, C. H., Yao , S., Wu , C., and Hsieh, C. (February 15, 2005). "Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics ." ASME. J. Heat Transfer. January 2005; 127(1): 66–75. https://doi.org/10.1115/1.1839586
Download citation file: