Conventional technology to cool desktop computers and servers is that of the “direct heat removal” heat sink, which consists of a heat sink/fan mounted on the CPU. Although this is a very cost effective solution, it is nearing its end of life. This is because future higher power CPUs will require a lower R-value than can be provided by this technology, within current size and fan limits. This paper discusses new technology that uses “indirect heat removal” technology, which involves use of a single or two-phase working fluid to transfer heat from the hot source to an ambient heat sink. This technology will support greater heat rejection than is possible with the “direct heat removal” method. Further, it will allow use of higher performance air-cooled ambient heat sinks than are possible with the “direct heat removal” heat sink. A concern of the indirect heat removal technology is the possibility that it may be orientation sensitive. This paper identifies preferred options and discusses the degree to which they are (or not) orientation sensitive. It should be possible to attain an R-value of 0.12 K/W at the balance point on the fan curve.
Skip Nav Destination
Article navigation
Article
Next Generation Devices for Electronic Cooling With Heat Rejection to Air
Ralph L. Webb
Ralph L. Webb
Search for other works by this author on:
Ralph L. Webb
Contributed by the Heat Transfer Division for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division April 12, 2004; revision received July 6, 2004. Assoc. Editor: C. Amon.
J. Heat Transfer. Jan 2005, 127(1): 2-10 (9 pages)
Published Online: February 15, 2005
Article history
Received:
April 12, 2004
Revised:
July 6, 2004
Online:
February 15, 2005
Citation
Webb, R. L. (February 15, 2005). "Next Generation Devices for Electronic Cooling With Heat Rejection to Air ." ASME. J. Heat Transfer. January 2005; 127(1): 2–10. https://doi.org/10.1115/1.1800512
Download citation file:
Get Email Alerts
Cited By
Related Articles
A Novel Approach to Low Profile Heat Sink Design
J. Heat Transfer (September,2010)
An Experimental Study on the Design of Miniature Heat Sinks for Forced Convection Air Cooling
J. Heat Transfer (July,2009)
Forced Convection in Microstructures for Electronic Equipment Cooling
J. Heat Transfer (August,1999)
Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink
J. Electron. Packag (September,2007)
Related Proceedings Papers
Related Chapters
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment, Second Edition
Cooling of a Chip Utilizing a Heat Sink with Rectangular Fins
Everyday Heat Transfer Problems: Sensitivities to Governing Variables