Abstract

Particle laden polymers are one of the most prominent thermal interface materials (TIM) used in electronics cooling. Most of the research has primarily dealt with the understanding of the thermal conductivity of these types of TIMs. For thermal design, reduction of the thermal resistance is the end goal. Thermal resistance is not only dependent on the thermal conductivity, but also on the bond line thickness (BLT) of these TIMs. It is not clear which material property(s) of these particle laden TIMs affects the BLT and eventually the thermal resistance. This paper introduces a rheology based semiempirical model for the prediction of the BLT of these TIMs. BLT depends on the yield stress of the particle laden polymer and the applied pressure. The BLT model combined with the thermal conductivity model can be used for modeling the thermal resistance of these TIMs for factors such as particle volume faction, particle shape, base polymer viscosity, etc. This paper shows that there exists an optimal filler volume fraction at which thermal resistance is minimum. Finally this paper develops design rules for the optimization of thermal resistance for particle laden TIMs.

Issue Section:
Thermal Systems
Keywords:
filled polymers, thermal conductivity, thermal resistance, yield stress, viscosity, rheology, cooling, packaging, interface structure, Contact Resistance, Heat Transfer, Interface, Rheological, Thermophysical
Topics:
Fluids, Particulate matter, Polymers, Rheology, Thermal conductivity, Thermal resistance, Viscosity, Yield stress, Modeling, Pressure, Silicones, Contact resistance
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