The heat transfer and the fluid dynamics characteristics of subsonic gas flows through microchannels are examined using the direct simulation Monte Carlo (DSMC) method. A simple implicit treatment for the low-speed inflow and outflow boundaries for the DSMC of the flows in microelectromechanical systems (MEMS) is used. Micro-Couette flows and micro-Poiseuille flows are simulated with the value of the Knudsen numbers ranging between 0.06 and 0.72. Where appropriate, the calculated velocity slip and temperature distribution are compared with analytical solutions derived from the Navier-Stokes equations with slip-boundary conditions. A patterned microstructure with nonuniform surface temperature is also simulated. The computational results show that the Knudsen number and the geometric complexity have significant effects on the heat transfer as well as the fluid dynamics properties of the microfluid flows studied.
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e-mail: Yichuan.Fang@wmich.edu
e-mail: William.Liou@wmich.edu
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Computations of the Flow and Heat Transfer in Microdevices Using DSMC With Implicit Boundary Conditions
Yichuan Fang,
e-mail: Yichuan.Fang@wmich.edu
Yichuan Fang
Department of Mechanical and Aeronautical Engineering, Western Michigan University, Kalamazoo, MI 49008
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William W. Liou, Associate Professor
e-mail: William.Liou@wmich.edu
William W. Liou, Associate Professor
Department of Mechanical and Aeronautical Engineering, Western Michigan University, Kalamazoo, MI 49008
Search for other works by this author on:
Yichuan Fang
Department of Mechanical and Aeronautical Engineering, Western Michigan University, Kalamazoo, MI 49008
e-mail: Yichuan.Fang@wmich.edu
William W. Liou, Associate Professor
Department of Mechanical and Aeronautical Engineering, Western Michigan University, Kalamazoo, MI 49008
e-mail: William.Liou@wmich.edu
Contributed by the Heat Transfer Division for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division May 2, 2001; revision received October 1, 2001. Associate Editor: H. Bau.
J. Heat Transfer. Apr 2002, 124(2): 338-345 (8 pages)
Published Online: October 1, 2001
Article history
Received:
May 2, 2001
Revised:
October 1, 2001
Citation
Fang, Y., and Liou, W. W. (October 1, 2001). "Computations of the Flow and Heat Transfer in Microdevices Using DSMC With Implicit Boundary Conditions ." ASME. J. Heat Transfer. April 2002; 124(2): 338–345. https://doi.org/10.1115/1.1447933
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