Lsaers are emerging as a valuable tool for shaping and cutting hard and brittle ceramics. Unfortunately, the large, concentrated heat flux rates that allow the laser to efficiently cut and shape the ceramic also result in large localized thermal stresses in a small heat-affected zone. These notable thermal stresses can lead to micro-cracks, a decrease in strength and fatigue life, and possibly catastrophic failure. In order to assess where, when, and what stresses occur during laser scribing, an elastic stress model has been incorporated into a three-dimensional scribing and cutting code. First, the code predicts the temporal temperature fields and the receding surface of the ceramic. Then, using the scribed geometry and temperature field, the elastic stress fields are calculated as they develop and decay during the laser scribing process. The analysis allows the prediction of stresses during continuous wave and pulsed laser operation, a variety of cutting speeds and directions, and various shapes and types of ceramic material. The results of the analysis show substantial tensile stresses develop over a thick layer below and parallel to the surface, which may be the cause of experimentally observed subsurface cracks.
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Transient Elastic Thermal Stress Development During Laser Scribing of Ceramics
Michael F. Modest,
Michael F. Modest
Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802
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Thomas M. Mallison
Thomas M. Mallison
Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802
Search for other works by this author on:
Michael F. Modest
Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802
Thomas M. Mallison
Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802
Contributed by the Heat Transfer Division for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division December 7, 1999; revision received, September 11, 2000. Associate Editor: D. Poulikakos
J. Heat Transfer. Feb 2001, 123(1): 171-177 (7 pages)
Published Online: September 11, 2000
Article history
Received:
December 7, 1999
Revised:
September 11, 2000
Citation
Modest , M. F., and Mallison, T. M. (September 11, 2000). "Transient Elastic Thermal Stress Development During Laser Scribing of Ceramics ." ASME. J. Heat Transfer. February 2001; 123(1): 171–177. https://doi.org/10.1115/1.1332779
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