Experiments have been performed using water to determine the single-phase forced convection heat transfer from in-line four simulated electronic chips, which are flush-mounted to one wall of a vertical rectangular channel. The effects of the most influential geometric parameters on heat transfer including chip number, and channel height are tested. The channel height is varied over values of 0.5, 0.7, and 1.0 times the heat source length. The heat flux is set at the three values of 5 W/cm2, 10 W/cm2, and 20 W/cm2, and the Reynolds number based on the heat source length ranges from 6 × 102 to 8 × 104. Transition Reynolds numbers are deduced from the heat transfer data. The experimental results indicate that the heat transfer coefficient is affected strongly by the number of chips and the Reynolds number and weakly by the channel height. Finally, the present results from liquid-cooling are compared with other results from air-cooling, and Prandtl number scaling between air and water is investigated.

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