The recent emphasis on low-cost high-end servers and desktop workstations has resulted in a renewed interest in the development of high-performance air-cooled systems. A new generation of advanced heat sink designs capable of dissipating up to 105 W/m2 have been proposed and developed. Better manufacturing tolerances, lower defects, and an improved understanding of card and enclosure effects have been attained and shown to be critical to achieving the desired thermal performance. Advanced internal thermal enhancements, encompassing high thermal conductivity adhesives and greases have also been implemented. This review article covers recent developments in heat sink designs and applications intended for high-end high-power dissipation systems. A review of recent studies of card effects in the thermal enhancement of electronic packages is also presented. In certain applications the card heat-sinking effect can play a major role in the thermal management of a package, accounting for more than 50 percent of the total power dissipation of the package.
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e-mail: sanjeev@us.ibm.com
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A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages
S. Sathe,
S. Sathe
Thermal & Mechanical Analysis Group, IBM Corporation, Microelectronics Division, 1701 North Street, Endicott, NY 13760
e-mail: sanjeev@us.ibm.com
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B. Sammakia
B. Sammakia
T. J. Watson School of Engineering, State University of New York, Binghamton, NY 13902-6000
e-mail: bahgat@binghamton.edu
Search for other works by this author on:
S. Sathe
Thermal & Mechanical Analysis Group, IBM Corporation, Microelectronics Division, 1701 North Street, Endicott, NY 13760
e-mail: sanjeev@us.ibm.com
B. Sammakia
T. J. Watson School of Engineering, State University of New York, Binghamton, NY 13902-6000
e-mail: bahgat@binghamton.edu
J. Heat Transfer. Nov 1998, 120(4): 830-839 (10 pages)
Published Online: November 1, 1998
Article history
Received:
July 12, 1998
Revised:
October 8, 1998
Online:
December 5, 2007
Citation
Sathe, S., and Sammakia, B. (November 1, 1998). "A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages." ASME. J. Heat Transfer. November 1998; 120(4): 830–839. https://doi.org/10.1115/1.2825902
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