Issue Section:
Technical Briefs
1.
Aung
W.
Worku
G.
1987
, “Mixed Convection in Ducts With Asymmetric Wall Heat Fluxes
,” ASME JOURNAL OF HEAT TRANSFER
, Vol. 109
, pp. 947
–951
.2.
Baek, B. J., Palaski, D. A., and Armaly, B. F., Chen, T. S., 1990, “Mixed Convection in an Asymmetrically Heated Vertical Parallel-Plate Duct Flow,” Proc. Ninth International Heat Transfer Conference, Jerusalem, lsrael, Vol. 2, pp. 369–374.
3.
Gau, C., Yih, K. A., and Aung, W., 1991, “Observed Flow Reversals and Heat Transfer Measurements for Buoyancy-Assisted Convection in a Heated Vertical Channel,” AIAA Paper No. 91-1309.
4.
Incropera
F. P.
1988
, “Convection Heat Transfer in Electronic Equipment Cooling
,” ASME JOURNAL OF HEAT TRANSFER
, Vol. 110
, pp. 1097
–1110
.5.
Kays, W. M., and Crawford, M. E., 1993, Convective Heat and Mass Transfer, McGraw-Hill, New York.
6.
Kim
S. H.
Anand
N. K.
Fletcher
L. S.
1991
, “Free Convection Between Series of Vertical Parallel Plates With Embedded Line Heat Sources
,” ASME JOURNAL OF HEAT TRANSFER
, Vol. 113
, pp. 108
–115
.7.
Kim, S. H., 1993, “A Numerical Analysis of Convective Heat Transfer in Channels Simulating Electronic Components,” Ph.D. Dissertation, Texas A&M University, College Station, TX.
8.
Patankar, S. V., 1980, Numerical Heat Transfer and Fluid Flow, Hemisphere, New York.
9.
Sathe, S., and Joshi, Y., 1990, “Natural Convection Liquid Cooling of a Substrate-Mounted Protrusion in a Square Enclosure: Effect of Thermophysical Properties, Geometric Dimensions and Boundary Conditions,” Thermal Modeling and Design of Electronic Systems and Devices, ASME HTD-Vol. 153, pp. 73–80.
10.
Watson, J. C., 1995, “Numerical Model of Mixed Convective Heat Transfer Between a Series of Vertical Parallel Plates With Planar Heat Sources,” M. S. Thesis, Texas A&M University.
11.
Watson, J. C., Anand, N. K., and Fletcher, L. S., “Mixed Convection Heat Transfer Between a Series of Vertical Parallel Plates With Planar Heat Sources,” ASME HTD-Vol. 317-1, pp. 401–412, 1995.
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