1.
Chung, K. C., 1992, “Thermal Contact Conductance of a Phase-Mixed Coating Layer by Transitional Buffering Interface,” Ph.D. Dissertation, Department of Mechanical and Aerospace Engineering and Engineering Mechanics, University of Missouri—Rolla.
2.
Chung
K. C.
,
Sheffield
J. W.
,
Sauer
H. J.
,
O’Keefe
T. J.
, and
Williams
A.
,
1993
, “
Thermal Contact Conductance of a Phase-Mixed Coating Layer by Transitional Buffering Interface
,”
AIAA Journal of Thermophysics and Heat Transfer
, Vol.
7
, No.
6
, pp.
326
333
.
3.
Fletcher, L. S., and Sparks, T. H., 1992, “Thermal Contact Conductance of Porous Ceramic Materials,” Proceedings of the NSF/DITAC Workshop on Thermal Conduction Enhancement in Microelectronics, A. Williams, ed., Melbourne, Australia, pp. 71–77.
4.
O’Callaghan
P. W.
,
Snaith
B.
,
Probert
S. D.
, and
Al-Astrabadi
F. R.
,
1983
, “
Prediction of Interfacial Filler Thickness for Minimum Thermal Contact Resistance
,”
AIAA Journal
, Vol.
21
, No.
9
, pp.
1325
1330
.
5.
Ochterbeck, J. M., Fletcher, L. S., and Peterson, G. P., 1990, “Evaluation of Thermal Enhancement Films for Electronic Packages,” Proceedings of the 9th International Heat Transfer Conference, Israel, pp. 445–450.
6.
Peterson
G. P.
, and
Fletcher
L. S.
,
1988
, “
Evaluation of Thermal Contact Conductance Between Mold Compound and Heat Spreader Materials
,”
ASME JOURNAL OF HEAT TRANSFER
, Vol.
110
, pp.
996
999
.
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