Laminar free convective heat transfer in channels formed between series of vertical parallel plates with an embedded line heat source was studied numerically. These channels resemble cooling passages in electronic equipment. The effect of a repeated boundary condition and wall conduction on mass flow rate (M), maximum surface temperature (θh,max and θc,max), and average surface Nusselt number (Nuh and Nuc) is discussed. Calculations were made for Gr*=10 to 106, K=0.1, 1, 10, and 100, and t/B=0.1 and 0.3. The effect of a repeated boundary condition decreases the maximum hot surface temperature and increases the maximum cold surface temperature. The effect of a repeated boundary condition with wall conduction increases the mass flow rate. The maximum increase in mass flow rate due to wall conduction is found to be 155 percent. The maximum decrease in average hot surface Nusselt number due to wall conduction (t/B and K) occurs at Gr*=106 and is 18 percent. Channels subjected to a repeated boundary condition approach that of a symmetrically heated channel subjected to uniform wall temperature conditions at K≥100.
Free Convection Between Series of Vertical Parallel Plates With Embedded Line Heat Sources
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Kim, S. H., Anand, N. K., and Fletcher, L. S. (February 1, 1991). "Free Convection Between Series of Vertical Parallel Plates With Embedded Line Heat Sources." ASME. J. Heat Transfer. February 1991; 113(1): 108–115. https://doi.org/10.1115/1.2910512
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