Performance of a new compact cooling unit for semiconductors, being composed of an atomizer, a fan, and a heat-dissipating surface with no fin, has been measured over a wide range of the mass flow rate of spray water, m˙, and the wall heat flux. The heat transfer performance of the present compact, unit with m˙ = 0 to 1.05 g/s, attains 1.8 to 20 times that of the parallel-plate channel under the same thermal conditions.

This content is only available via PDF.
You do not currently have access to this content.