In the current semiconductor industrial scenario, wafers are rinsed in an overflow rinsing tank while being mounted on several lifters prior to most of its manufacturing processes. However, a major drawback of this overflow rinsing methodology is that some of the processing fluid stagnates due to the generated vortices in the regions between the side and middle lifters which entrap some of the flushed particles that further adhere and deteriorate the surface of the wafers. In this work, the hydrodynamics of the flow field inside the wafer rinsing tank with this original lifter orientation setup was studied and compared through numerical simulation and flow visualization using particle image velocimetry (PIV) method, and a strong agreement was found between them in terms of velocity calculation. A new lifter orientation setup was initiated and it was evidenced by the numerical simulation that with this new setup, the generated vortices which are situated opposite to the lifters tilting direction can be displaced significantly in terms of magnitude and distribution. This work presents a new wafer cleaning concept which shows its great potentials in improvement and implementation to the current in-line wafer batch fabrication process without modifying the original design of the rinsing tank.
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August 2018
Research-Article
Hydrodynamic Investigation of a Wafer Rinse Process Through Numerical Modeling and Flow Visualization Methods
Chia-Yuan Chen,
Chia-Yuan Chen
Department of Mechanical Engineering,
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: chiayuac@mail.ncku.edu.tw
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: chiayuac@mail.ncku.edu.tw
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Bivas Panigrahi,
Bivas Panigrahi
Department of Mechanical Engineering,
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: n18047068@mail.ncku.edu.tw
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: n18047068@mail.ncku.edu.tw
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Kok-Shen Chong,
Kok-Shen Chong
Fab-14 Diffusion Engineering Department 1,
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: chongsam01@gmail.com
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: chongsam01@gmail.com
Search for other works by this author on:
Wei-Hsien Li,
Wei-Hsien Li
Fab-14 Diffusion Engineering Department 1,
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: whli@tsmc.com
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: whli@tsmc.com
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Yi-Li Liu,
Yi-Li Liu
Fab-14 Diffusion Engineering Department 1,
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: ylliur@tsmc.com
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: ylliur@tsmc.com
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Tsung-Yi Lu
Tsung-Yi Lu
Department of Mechanical Engineering,
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: n16051126@mail.ncku.edu.tw
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: n16051126@mail.ncku.edu.tw
Search for other works by this author on:
Chia-Yuan Chen
Department of Mechanical Engineering,
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: chiayuac@mail.ncku.edu.tw
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: chiayuac@mail.ncku.edu.tw
Bivas Panigrahi
Department of Mechanical Engineering,
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: n18047068@mail.ncku.edu.tw
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: n18047068@mail.ncku.edu.tw
Kok-Shen Chong
Fab-14 Diffusion Engineering Department 1,
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: chongsam01@gmail.com
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: chongsam01@gmail.com
Wei-Hsien Li
Fab-14 Diffusion Engineering Department 1,
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: whli@tsmc.com
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: whli@tsmc.com
Yi-Li Liu
Fab-14 Diffusion Engineering Department 1,
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: ylliur@tsmc.com
Taiwan Semiconductor Manufacturing
Company (TSMC),
Tainan 741, Taiwan
e-mail: ylliur@tsmc.com
Tsung-Yi Lu
Department of Mechanical Engineering,
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: n16051126@mail.ncku.edu.tw
National Cheng Kung University,
Tainan 701, Taiwan
e-mail: n16051126@mail.ncku.edu.tw
1Corresponding author.
Contributed by the Fluids Engineering Division of ASME for publication in the JOURNAL OF FLUIDS ENGINEERING. Manuscript received August 11, 2017; final manuscript received January 30, 2018; published online April 10, 2018. Assoc. Editor: Hui Hu.
J. Fluids Eng. Aug 2018, 140(8): 081106 (8 pages)
Published Online: April 10, 2018
Article history
Received:
August 11, 2017
Revised:
January 30, 2018
Citation
Chen, C., Panigrahi, B., Chong, K., Li, W., Liu, Y., and Lu, T. (April 10, 2018). "Hydrodynamic Investigation of a Wafer Rinse Process Through Numerical Modeling and Flow Visualization Methods." ASME. J. Fluids Eng. August 2018; 140(8): 081106. https://doi.org/10.1115/1.4039368
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