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Keywords: stress-strain relations
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041006.
Published Online: December 9, 2011
...-strain relations viscoelasticity thermomechanical analysis temperature-dependent property (strain, strain-stress, and stress) conservation laws nonincremental solution residual strain Concept of molding and post mold cure process Sketch of a multimaterial structure...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044501.
Published Online: November 17, 2011
... packaging solders stress-strain relations Table 1 Constants, parameters, and properties in the creep models G, H, and I Creep data A G A H A I G(GPa) Q(J/mol) β G β H β I n d( μ m) p b(nm...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021007.
Published Online: June 25, 2010
... chip scale packaging cracks elastoplasticity finite element analysis fracture mechanics solders stress-strain relations thermal analysis Weibull distribution Lee , W. W. , Nguyen , L. T. , and Selvaduray , G. S. , 2000 , “ Solder Joint Fatigue Models: Review and...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
Published Online: June 16, 2009
... circuit reliability solders stress-strain relations tensile strength tin compounds lead-free solder strain rate effect tensile strength split Hopkinson tensile bar Tummala , R. R. , Rymaszewski , E. J. , and Klopfenstein , A. G. , 1997 , Microelectronics Packaging...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
Published Online: March 27, 2009
... and strain maintenance. Time-independent strains are obtained from the stress-strain relations at the instantaneously strained parts, while the time-dependent strains are obtained from the stress-time relations during the strain maintaining periods. Based on the obtained time-independent and time...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
... reliability life testing silver alloys solders stress-strain relations tin alloys DLS test assembly, and edge and face views Sample of pad array crack length template Schematic of the data analysis approach Crack growth rate versus crack length at 25 ° C...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021010.
Published Online: May 15, 2008
... interface after the thermal loading. 16 02 2007 07 09 2007 15 05 2008 interconnect interface interferometer micropolar theory ball grid arrays integrated circuit interconnections stress-strain relations thermal analysis Tummala...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011002.
Published Online: January 31, 2008
..., NASA Technical Memorandum No. 107313. pp. 1 – 10 . copper alloys creep fatigue finite element analysis plasticity silver alloys stress-strain relations tin alloys Material parameters for UCPD constitutive model ( 18 ) − 55 ° C − 25 ° C 25 ° C...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
... analysis silver alloys soldering solders stress-strain relations surface finishing tin alloys Inelastic strain energy density (MPa) from FEA simulation Displacement 1 mm 1.25 mm 1.5 mm 2.16 mm 3.6 mm 25 ° C bend...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
... Assessment of Two Lead-Free High Temperature Solder Alloys ,” Mater. Res. Soc. Symp. Proc. 0272-9172 , 445 , pp. 307 – 312 . fatigue testing creep solders finite element analysis stress-strain relations electronics packaging eutectic alloys stress effects shear deformation creep testing...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 496–502.
Published Online: March 30, 2005
... Test Methods ,” Proc. 55th ECTC , Florida, pp. 1194 – 1201 . Singiresu , S. R. , 1995 , “ Mechanical Vibrations ,” 3rd ed. , Addison-Wesley , Reading, MA. impact testing printed circuit testing stress-strain relations reliability electronic packaging drop impact finite...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 430–439.
Published Online: December 21, 2004
... ball grid array printed wiring boards ball grid arrays creep solders soldering assembling printed circuit manufacture stress relaxation stress-strain relations tin alloys lead alloys silver alloys integrated circuit packaging finite element analysis (a) Three-dimensional...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 582–588.
Published Online: December 15, 2003
... Joint Reliability, Theory and Applications, Edited by J. H. Lau, Van Nostrand Reinhold, New York, pp. 545–587. soldering alloys fatigue chip scale packaging deformation thermal shock stress-strain relations viscoplasticity interface phenomena failure analysis Experimental design...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 4–17.
Published Online: March 14, 2003
.... Author to whom correspondence should be made. piezoelectric devices piezoelectric thin films micromechanical devices finite element analysis stress analysis stress-strain relations thermal expansion internal stresses 1 Design and fabricate a simple thin-film structure sample(s), and...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 234–239.
Published Online: July 26, 2002
... devices fatigue ductility stress-strain relations lead bonding integrated circuit interconnections finite element analysis Results of FEM analysis of WIT package Model Incremental equivalentplastic strain (%) No. of cycles Conventional WLP model 2.68 530 Model 1...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 277–280.
Published Online: July 26, 2002
...-strain relations finite element analysis thermal expansion creep displacement measurement 1 Temperature dependent CTE results for BT resin materials 2 Typical phase map image from tensile testing, resulting y -displacement, and calculated Y -axis tensile strain 3 Stress...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. June 2001, 123(2): 141–146.
Published Online: October 10, 2000
... Rayleigh-Ritz methods viscoplasticity stress-strain relations 1 Schematic comparison of conventional finite element mesh with NFEM mesh 2 Schematic comparison of nesting localized subelements 3 Terminology of possible configurations of colonies of nested subelements within a...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 267–273.
Published Online: September 1, 2000
... stress-strain relations crack-edge stress field analysis 1 Geometry of two-layer system 2 Schematic of internal stresses in composite 3 Schematic of final stress state as superposition of two stress states 4 Polar coordinate system for the analysis of local stress...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 70–73.
Published Online: June 28, 2000
... ,” Phys. Rev. , 174 , No. 3 , pp. 977 – 983 . optical glass glass fibres optical fibres bending stress-strain relations 1 Geometry of fiber subjected to two-point bending 2 Fiber cross-section 3 Maximum tensile strain and stress in silica optical fibers...
Journal Articles
Article Type: Errata
J. Electron. Packag. March 2000, 122(1): 74.
Published Online: March 1, 2000
...X. Q. Shi,; W. Zhou,; H. L. J. Pang, and; Z. P. Wang [S1043-7398(00)01601-7] eutectic alloys soldering thermomechanical treatment stress-strain relations mechanical properties The authors mistakenly stated that the paper “On Constitutive Response of 63/37 Pn/Sb Eutectic Solder...