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Keyword: silver alloys
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
... 06 2011 ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high reliability microelectronics...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041010.
Published Online: December 3, 2010
... creep fatigue testing silver alloys solders tin alloys lead-free solder low-cycle fatigue strain rate effect creep strain stress relaxation cyclic loading Solder joints are subjected to cyclic inelastic deformation due to electronic parts having different coefficients of thermal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041003.
Published Online: November 23, 2010
... strength copper alloys creep elastoplasticity electronics packaging fatigue mechanical testing silver alloys solders tensile strength tin alloys lead-free solder alloy elastic-plastic-creep constitutive model time-independent strain time-dependent strain cyclic plasticity stress...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041001.
Published Online: November 19, 2010
... roughness. Estimated activation energies for solder spreading were found to be in between those reported for inert and highly reactive spreading systems. 01 02 2010 03 10 2010 19 11 2010 19 11 2010 eutectic alloys interface phenomena lead alloys silver alloys solders surface...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021002.
Published Online: March 27, 2009
... 2008 27 03 2009 copper copper alloys electromigration failure analysis flip-chip devices gold alloys metallisation nickel alloys silver alloys solders substrates tin alloys electromigration reliability flip-chip solder joint substrate pad metallization An...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
Published Online: March 27, 2009
... 27 03 2009 copper alloys creep deformation elastoplasticity silver alloys solders stress-strain relations tensile testing tin alloys viscoplasticity lead-free solder alloy elasto-plastic-creep constitutive model time-independent deformation time-dependent deformation...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011014.
Published Online: February 18, 2009
... and SnAg solder is reliable. 29 04 2007 19 02 2008 18 02 2009 electroplating metallurgy scanning electron microscopy shear strength silver alloys solders tin alloys voids (solid) X-ray chemical analysis SnAg solder bump reliability Flip-chip...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
... finite element analysis integrated circuit interconnections integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys As technology progresses, both consumer and military products are making greater use of electronics...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011002.
Published Online: February 11, 2009
.... 25 09 2007 17 04 2008 11 02 2009 annealing copper alloys grain boundary diffusion hardness hardness testing high-temperature effects silver alloys solders thermal diffusion tin alloys thermomigration lead-free hardness elastic modulus grain coarsening The...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041001.
Published Online: November 13, 2008
... enhance the electromigration reliability. 01 08 2007 07 01 2008 13 11 2008 copper alloys electromigration flip-chip devices gold nickel reliability silver alloys solders tin alloys titanium vanadium electromigration flip-chip solder joint reliability Sn–Ag–Cu Cu...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031008.
Published Online: August 1, 2008
..., whereas impeded by a bigger one. 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders tin alloys...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031004.
Published Online: July 29, 2008
... 2008 29 07 2008 creep crystal microstructure silver alloys solders tin alloys constitutive model creep SnAg lead-free solder Lead-free solders such as SnAg and SnAgCu are used extensively as replacements of SnPb solders in microelectronics packaging. It has been found...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... integrated circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling Solder joint fatigue has been the subject of a great...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011005.
Published Online: January 31, 2008
... circuits silver alloys solders tin alloys reliability flip chip thermal cycling micro-via Thermal excursions for electronic devices imparted during their operation can change the microstructure of their solder joints and cause the stress concentration, resulting in deformation and crack...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011002.
Published Online: January 31, 2008
... obtained as demonstrated by a comparison of results generated from FEA simulation of the test assembly against analogous experimental results. 27 09 2006 06 07 2007 31 01 2008 copper alloys creep fatigue finite element analysis plasticity silver alloys stress-strain relations...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011003.
Published Online: January 31, 2008
... techniques, are discussed in terms of improving both the UCPD constitutive model and the fatigue life prediction methodology fidelity and decreasing the solution time. 13 10 2006 19 07 2007 31 01 2008 copper alloys creep fatigue cracks finite element analysis plasticity silver...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
... VQFN with Sn–Ag–Cu solder joint under cyclic bending load at both 25°C and 125°C. 23 01 2007 27 08 2007 bending strength copper alloys electronics packaging fatigue testing finite element analysis silver alloys soldering solders stress-strain relations surface finishing tin...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
... was also conducted to determine possible fatigue failure mechanisms. 14 03 2006 23 06 2006 fatigue testing creep solders finite element analysis stress-strain relations electronics packaging eutectic alloys stress effects shear deformation creep testing tin alloys silver...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 82–89.
Published Online: May 21, 2006
... correlation to the creep deformation and that the correlation is different for lead-free and lead-containing solder alloys. 06 12 2005 21 05 2006 solders electronics packaging creep testing deformation tin alloys lead alloys silver alloys copper alloys Lead-free solder alloys...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 56–62.
Published Online: May 19, 2006
... were examined, correlated, and discussed. 01 11 2005 19 05 2006 flip-chip devices electromigration solders integrated circuit interconnections life testing fatigue testing reliability temperature distribution tin alloys copper alloys silver alloys current density...