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Keywords: refrigeration
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031002.
Published Online: September 8, 2010
... ) of the conventional TEC as a function of r o c 05 11 2009 20 04 2010 08 09 2010 bismuth compounds contact resistance cooling Ge-Si alloys heat transfer microfluidics micromechanical devices Peltier effect refrigeration refrigerators semiconductor device models...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2009, 131(2): 024501.
Published Online: March 27, 2009
...Cheng-Wei Tien; Kun-Huang Yu; Wen-Junn Sheu; Chi-Chuan Wang This study examines the refrigerant distribution of a dual cold-plate system subject to the influence of heating load, using a R-134a based vapor compression system with a nominal capacity ranging from 50 W to 250 W. The cold plate...
Journal Articles
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041103.
Published Online: November 13, 2008
...Victor Chiriac; Florea Chiriac Classical refrigeration using vapor compression has been widely applied over the past decades to large-scale industrial systems, with few known applications to the microelectronic cooling field, due to the small size limitation. The present study proposes an efficient...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 291–299.
Published Online: March 28, 2007
... and thermohydraulic performance evaluation of high heat flux evaporators suitable for interfacing the microprocessor chip with a cascaded R134a∕R508b vapor compression refrigeration system at − 80 ° C . Four compact evaporator designs are examined—a base line slit-flow structure with no microfeatures, straight...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 30–37.
Published Online: June 17, 2005
... as an evaporator in an R134a refrigeration loop. This system is capable of maintaining device temperatures below 55 ° C while dissipating in excess of 100 W ∕ cm 2 . It is shown that while higher heat transfer coefficients are possible with greater mass velocities, those conditions are typically associated...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 554–559.
Published Online: January 24, 2005
.... The current research focuses on mainframes (computer system), which uses a conventional refrigeration system to maintain chip temperatures below that of comparable air-cooled systems, but well above cryogenic temperatures. Multivariable control of compressor speed along with thermostatic expansion valve (TXV...