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Keywords: reflow soldering
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
... that comparisons of test results may not reflect relative performances under service conditions. This was illustrated with for a set of model BGA components with 20 mil (0.5 mm) diameter SAC305 solder balls, which were reflow soldered onto printed circuit boards using a eutectic SnPb solder paste and tested...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041013.
Published Online: December 8, 2010
... 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer bonding flip chip no flow viscous misalignment self-alignment solder wetting dynamics While next generation flip chip processing holds many...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 331–338.
Published Online: September 29, 2005
... of the various approaches are mutually consistent. 29 12 2004 29 09 2005 flip-chip devices reflow soldering solders surface tension eutectic alloys As demands on the performance of computers, communication systems, and optoelectronic products rapidly increase, electronic packaging...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
...W. K. Chiang; Y. C. Chan This paper presents the reliability of anisotropic conductive film (ACF) joint tested under reflow soldering and environmental test effect. The ACF joint behaved differently under different reflow soldering profiles. The lower reflow temperature resulted in more reliable...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 541–545.
Published Online: January 24, 2005
.... 01 May 2003 01 April 2004 24 01 2005 solders reflow soldering flip-chip devices curing chip scale packaging integrated circuit packaging integrated circuit reliability In the near future, conventional leaded packages are not expected to be able to handle high pin...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
Published Online: January 13, 2005
... of the package was 892 h, and the average ultimate service time of the package was 1053 h. 17 08 2004 13 01 2005 metallisation reliability integrated circuit packaging reflow soldering testing tin aluminium alloys nickel alloys vanadium alloys copper alloys dies (machine tools...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 440–445.
Published Online: January 4, 2005
... 04 01 2005 solders cooling flip-chip devices melting microassembling directional solidification integrated circuit packaging voids (solid) lead alloys tin alloys silver alloys reflow soldering In a flip chip assembly, the solder joints connecting the chip and its circuit...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 365–369.
Published Online: December 22, 2004
...°C. An electrolytic Ni ∕ solder system has a relatively higher shear load, a lower dissolution rate of the Ni layer, and is more protective for the Cu layer during extended times of reflow. 05 08 2003 22 12 2004 ball grid arrays reflow soldering solders reliability nickel...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 290–298.
Published Online: October 5, 2004
... reliability viscoelasticity reflow soldering surface tension wetting finite element analysis Ball Grid Array Coplanarity Eutectic Solder Finite Element Analysis High Lead Solder Hydrostatic Pressure Leadless Microelectronics Micro Lead Frame Packaging Perzyna Rigid Plastic Solder Joints...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 120–126.
Published Online: May 18, 2004
... devices integrated circuit reliability microassembling integrated circuit packaging reflow soldering voids (solid) Flip-chip technology has been positioned as a key electronic packaging technology to meet the requirement of low-cost, lightweight, small size, and high-performance devices ( 1...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 52–56.
Published Online: April 30, 2004
... issues. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2003. Associate Editor: K. Kishimoto. 01 June 2003 30 04 2004 reflow soldering surface tension wetting thermomechanical...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 335–346.
Published Online: September 17, 2003
... for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division February 21, 2002. Associate Editor: R. Wirtz. 21 February 2002 17 09 2003 reflow soldering surface mount technology printed circuit manufacture modelling heat transfer melting...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 329–334.
Published Online: September 17, 2003
... 2003 bubbles reflow soldering voids (solid) surface tension viscosity flip-chip devices microassembling integrated circuit packaging The reliability of solder bumps has become more critical as the components become smaller. Figure 1 shows a typical flip-chip assembly commonly...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
... surface mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection Defect PBGA Assembly Soldering Profile Surface Mount Technology PBGAs provide superior electrical performance, such as lower inductance and higher density of I/O...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 39–43.
Published Online: March 14, 2003
... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, December 3, 2001. Associate Editor: Y.-H. Pao. 03 December 2001 14 03 2003 flip-chip devices reflow soldering inspection quality control light...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 153–156.
Published Online: March 14, 2003
... 19, 2002. Associate Editor: Y.-H. Pao. 19 March 2002 14 03 2003 copper alloys tin alloys reflow soldering ball grid arrays plastic packaging annealing chemical interdiffusion crystallisation solidification ageing Plastic BGA Solder Joint Cooling Rate Cu-Sn...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 31–38.
Published Online: March 14, 2003
... moulding plastic packaging integrated circuit packaging delamination thermal stress cracking bending finite element analysis reflow soldering failure analysis Plastic packaging is the most popular technique in electronic packaging because of its low costs and ease of manufacture. However...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 323–327.
Published Online: December 12, 2002
...Noriyasu Kawamura; Takashi Kawakami; Kikuo Kishimoto; Masaki Omiya; Toshikazu Shibuya Plastic encapsulated semiconductor packages may crack at the corner regions of die pads or chips if internal delamination occurs at an elevated temperature during the reflow soldering process. Thus, the structural...
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 397–402.
Published Online: December 12, 2002
... flip-chip devices integrated circuit interconnections encapsulation integrated circuit packaging plastic packaging shear strength heat treatment interface structure reflow soldering surface chemistry As the trend in requirements of electronic packaging is toward higher I/O, greater...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 184–187.
Published Online: July 26, 2002
...-on-board packaging reflow soldering swelling environmental degradation viscoplasticity life testing finite element analysis ageing thermal stress cracking integrated circuit interconnections The direct attachment of a flip chip die to an organic substrate with eutectic (63Sn/37Pb) solder...