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Keywords: product design
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 465–471.
Published Online: January 24, 2005
.... Sammakia. 27 April 2004 31 May 2004 24 01 2005 electronics packaging cooling product design convection turbulence flow simulation finite volume methods Cooling of electronic components is one of the main barriers to developing faster, smaller, and more reliable...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 501–509.
Published Online: January 24, 2005
... h ad A Power dissipation Manuscript received May 10, 2004; revision received October 5, 2004. Review conducted by: B. Sammakia. 10 May 2004 05 October 2004 24 01 2005 electronics packaging heat transfer turbulence thermal analysis product...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 410–422.
Published Online: January 24, 2005
...) product design thermal analysis Taguchi methods quadratic programming response surface methodology thermal resistance Optimal Thermal Design PPF Heat Sink DOE CCD RSM SQP Thermal Resistance Pressure Loss In recent years, heat sink is the most common thermal management hardware...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 8–13.
Published Online: April 30, 2004
... February 2002 30 04 2004 thermal energy storage finite volume methods product design correlation methods Many multi-chip modules such as portable electronic devices have variable power dissipation rates. As a consequence, conventional electronics module coolers must be designed...