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Keywords: probes
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 411–418.
Published Online: December 12, 2002
...Mudasir Ahmad; Suresh K. Sitaraman Advances in integrated circuit fabrication have created a need for an innovative, inexpensive, yet reliable probing technology with ultra-fine pitch capability. Research teams at Georgia Tech, Xerox PARC, and NanoNexus, Inc. are developing flexible micro-spring...
