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Keywords: printed circuit manufacture
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
Published Online: June 23, 2011
... testing printed circuit manufacture solders synchrotron radiation thermal stress cracking X-ray imaging thermal fatigue life prediction crack propagation phase growth solder joints flip chip, nondestructive inspection x-ray microtomography synchrotron radiation. In electronic...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031007.
Published Online: July 30, 2008
... model of the press-fit assembly for determining μ 16 11 2007 01 02 2008 30 07 2008 assembling elasticity finite element analysis plasticity press fitting printed circuit manufacture press-fit assembly solderless technology finite element analysis...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 205–215.
Published Online: July 23, 2006
... numerical model was extended to study the cases of varying substrate thermal conditions. An empirical relation is proposed for evaluating Nu under different substrate thermal conditions for array geometries considered and flow rates within the parametric ranges discussed. printed circuit manufacture...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 441–448.
Published Online: February 23, 2006
... for Moiré Interferometry ,” Proceedings of the Society of Experimental Mechanics , Cincinnati, OH, June 11–13, pp. 11 – 14 . 05 10 2005 23 02 2006 assembling surface mount technology printed circuit manufacture ball grid arrays chip scale packaging finite element analysis...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 236–245.
Published Online: November 24, 2005
... Method for Tensile Properties of Thin Plastic Sheeting. 13 02 2005 24 11 2005 printed circuit manufacture wireless sensor networks electronics packaging polymers flexible electronics thin flexible substrates three dimensional (3D) packaging folded flex wireless sensor...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 483–495.
Published Online: March 21, 2005
... , “ Reliability of Soldered Joints: a Description of the State of the Art, Part 1 ,” Surf. Mount. Technol. 0893-3588 , 4 , pp. 27 – 38 . ball grid arrays integrated circuit packaging printed circuit manufacture solders tensile testing printed circuit testing finite element analysis tin alloys...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 430–439.
Published Online: December 21, 2004
... printed circuit manufacture stress relaxation stress-strain relations tin alloys lead alloys silver alloys integrated circuit packaging finite element analysis creep strain rate 62%Sn–36%Pb–2%Ag alloy area array package chips CSP ball grid array printed wiring boards An area...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 282–287.
Published Online: October 6, 2004
... circuit manufacture finite element analysis thermoelasticity printed circuit design Printed circuit boards (PCB’s) are generally constructed using two types of routing strategies depending on the complexity of a design: X-Y or Maze routing. As shown in Fig. 1 , the X-Y routing technique...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 200–207.
Published Online: July 17, 2004
...) miniaturized products need to be supported by microelectronic packages that have fine interconnections, which are inherently vulnerable to drop impact, as shall be explained in a later section. Electronic Packaging Drop Impact Dynamics Finite Element printed circuit manufacture electronics...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 245–254.
Published Online: June 26, 2004
... of Electronic Systems ,” IEEE Trans. Compon. Packag. Technol. 1521-3331 , 25 ( 3 ), pp. 366 – 382 . 21 01 2003 26 06 2004 printed circuits printed circuit manufacture thermal management (packaging) natural convection ball grid arrays printed circuit testing surface mount...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2004, 126(1): 173–176.
Published Online: April 30, 2004
... production planning manufacturing processes assembling soldering surface mount technology fine-pitch technology printed circuit manufacture integrated circuit reliability laser beam applications 01 March 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 335–346.
Published Online: September 17, 2003
.... The final component of the solder paste is the vehicle system which provides suspending power for alloy particles and designated paste rheology (Hwang 1 ). reflow soldering surface mount technology printed circuit manufacture modelling heat transfer melting solidification cooling...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
... mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection 2003 ASME ...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 18–23.
Published Online: March 14, 2003
... . Manuscript received by the EPPD Division, December 3, 2001. Associate Editor: S. M. Heinrich. 03 December 2001 14 03 2003 fracture mechanics soldering printed circuit manufacture fatigue cracks packaging Solder grid arrays (SGA) and the related ball grid arrays (BGA) have...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 367–370.
Published Online: December 12, 2002
... 2000 01 May 2002 12 12 2002 adhesives surface mount technology printed circuit manufacture Taguchi methods design of experiments mechanical properties conducting polymers Electronic devices manufacturers are interested in research and development of new materials...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 205–211.
Published Online: July 26, 2002
... packaging printed circuit manufacture integrated circuit reliability life testing integrated circuit testing The Norton’s steady-state creep relation 17 , (1) d γ crp / dt = B *   exp { − Δ H / kT } τ n is used for creep analysis of the solder joints...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 254–259.
Published Online: July 26, 2002
... . Manuscript received by the EPPD December 7, 2000. Associate Editor: S. M. Heinrich. 07 December 2000 26 07 2002 fatigue circuit reliability printed circuit manufacture packaging production testing fracture Thin Films Flexible Printed Circuitry (FPC) High Cycle Fatigue...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 212–220.
Published Online: July 26, 2002
... cost is increased and the manufacturing throughput is reduced. In addition, the rework of an underfilled flip chip on PCB is very difficult, if it is not impossible. thermal stress cracking printed circuit manufacture life testing production testing fracture mechanics finite element...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 69–76.
Published Online: May 2, 2002
... 02 05 2002 creep chip scale packaging soldering printed circuit manufacture circuit reliability tin alloys silver alloys indium The unique physical and mechanical properties of the low-cost tin-lead solders have facilitated printed circuit board (PCB) assembly choices...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 45–53.
Published Online: January 1, 2001
... thermal analysis wave soldering printed circuit manufacture stress analysis cooling circuit reliability Integrity of plated through holes (PTHs), as shown in Fig. 1 , has become one of the primary printed wiring board (PWB) reliability concerns either during the component assembly process...