1-20 of 22
Keywords: printed circuit manufacture
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
Published Online: June 23, 2011
... integrated circuit testing microcracks nondestructive testing printed circuit manufacture solders synchrotron radiation thermal stress cracking X-ray imaging thermal fatigue life prediction crack propagation phase growth solder joints flip chip, nondestructive inspection x-ray...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031007.
Published Online: July 30, 2008
... 01 02 2008 30 07 2008 assembling elasticity finite element analysis plasticity press fitting printed circuit manufacture press-fit assembly solderless technology finite element analysis elastic-plastic properties friction coefficient Due to concerns about...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 205–215.
Published Online: July 23, 2006
... printed circuit manufacture cooling electronics packaging convection substrate printed circuit boards (PCB) heated modules Vertical two-dimensional channels formed by pair of parallel plates (cards or fins) are frequently encountered configuration for air cooled electronic equipments...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 441–448.
Published Online: February 23, 2006
... 2005 23 02 2006 assembling surface mount technology printed circuit manufacture ball grid arrays chip scale packaging finite element analysis bending failure analysis solders materials testing reliability The increasing demand for smaller and faster products...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 236–245.
Published Online: November 24, 2005
... that specific steps, such as polymer support ring formation, could be employed to eliminate impact of wrinkling on the process of developing the 5 mm cube prototypes. 13 02 2005 24 11 2005 printed circuit manufacture wireless sensor networks electronics packaging polymers flexible...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 483–495.
Published Online: March 21, 2005
... circuit manufacture solders tensile testing printed circuit testing finite element analysis tin alloys silver alloys lead alloys failure analysis testing 62/63/2 solder in situ solder characterization area array package chips BGA printed wiring boards test methods failure modes...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 430–439.
Published Online: December 21, 2004
... balls. 08 06 2004 21 12 2004 ball grid arrays creep solders soldering assembling printed circuit manufacture stress relaxation stress-strain relations tin alloys lead alloys silver alloys integrated circuit packaging finite element analysis creep strain rate 62%Sn–36...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 282–287.
Published Online: October 6, 2004
... circuit testing printed circuit manufacture finite element analysis thermoelasticity printed circuit design Printed circuit boards (PCB’s) are generally constructed using two types of routing strategies depending on the complexity of a design: X-Y or Maze routing. As shown in Fig. 1 , the X-Y...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 200–207.
Published Online: July 17, 2004
... and effectively modeled using the standard implicit time-integration code. 10 05 2004 17 07 2004 printed circuit manufacture electronics packaging bending finite element analysis heat transfer Electronic Packaging Drop Impact Dynamics Finite Element There has been increasing...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 245–254.
Published Online: June 26, 2004
... captured. 21 01 2003 26 06 2004 printed circuits printed circuit manufacture thermal management (packaging) natural convection ball grid arrays printed circuit testing surface mount technology With ever-reducing product development cycle times preventing extensive...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2004, 126(1): 173–176.
Published Online: April 30, 2004
... March 2003 30 04 2004 computer aided production planning manufacturing processes assembling soldering surface mount technology fine-pitch technology printed circuit manufacture integrated circuit reliability laser beam applications High value printed circuit boards used...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 335–346.
Published Online: September 17, 2003
... for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division February 21, 2002. Associate Editor: R. Wirtz. 21 February 2002 17 09 2003 reflow soldering surface mount technology printed circuit manufacture modelling heat transfer melting...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
... surface mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection Defect PBGA Assembly Soldering Profile Surface Mount Technology PBGAs provide superior electrical performance, such as lower inductance and higher density of I/O...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 18–23.
Published Online: March 14, 2003
... Division, December 3, 2001. Associate Editor: S. M. Heinrich. 03 December 2001 14 03 2003 fracture mechanics soldering printed circuit manufacture fatigue cracks packaging Solder grid arrays (SGA) and the related ball grid arrays (BGA) have gained popularity for surface...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 367–370.
Published Online: December 12, 2002
... at Poly 2000, London, United Kingdom, December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 adhesives surface mount technology printed circuit manufacture Taguchi methods design...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 205–211.
Published Online: July 26, 2002
.... Associate Editor: Yi-Hsin Pao. 09 August 2000 26 07 2002 reflow soldering flip-chip devices creep chip scale packaging printed circuit manufacture integrated circuit reliability life testing integrated circuit testing By IPC’s definition, holes with 6 mils (0.15 mm...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 254–259.
Published Online: July 26, 2002
... . Manuscript received by the EPPD December 7, 2000. Associate Editor: S. M. Heinrich. 07 December 2000 26 07 2002 fatigue circuit reliability printed circuit manufacture packaging production testing fracture Thin Films Flexible Printed Circuitry (FPC) High Cycle Fatigue...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 212–220.
Published Online: July 26, 2002
... stress cracking printed circuit manufacture life testing production testing fracture mechanics finite element analysis creep fracture chip scale packaging reflow soldering There are at least two major reasons why directly attaching the solder bumped flip chip on PCB is not popular yet 1...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 69–76.
Published Online: May 2, 2002
... 02 05 2002 creep chip scale packaging soldering printed circuit manufacture circuit reliability tin alloys silver alloys indium The unique physical and mechanical properties of the low-cost tin-lead solders have facilitated printed circuit board (PCB) assembly choices...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 45–53.
Published Online: January 1, 2001
... thermal analysis wave soldering printed circuit manufacture stress analysis cooling circuit reliability Integrity of plated through holes (PTHs), as shown in Fig. 1 , has become one of the primary printed wiring board (PWB) reliability concerns either during the component assembly process...