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Keywords: power module
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021102.
Paper No: EP-21-1053
Published Online: September 13, 2021
...Mitsuaki Kato; Takahiro Omori; Akihiro Goryu; Tomoya Fumikura; Kenji Hirohata Power modules are being developed to increase power output. The larger current densities accompanying increased power output are expected to degrade solder joints in power modules by electromigration. In previous research...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021101.
Paper No: EP-21-1047
Published Online: September 13, 2021
... excellent heat dissipation and miniaturized system simultaneously. However, a traditional architecture of power module, direct bonding copper substrate, has serious warpage deformation and limitation of the heat dissipation. Therefore, a power module with an insulated metal substrate (IMS) is proposed...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020801.
Paper No: EP-20-1074
Published Online: August 27, 2020
...Noriyuki Miyazaki; Nobuyuki Shishido; Yutaka Hayama This paper reviews the previous research on the methodologies for evaluating structural integrity of wire bonds and die-attachments in power modules. Under power module operation, these parts are subjected to repeated temperature variations which...