... residual strain from polymer forming. Furthermore, the nonincrement approach is implemented by a concept of force and moment equilibrium on the flexural stiffness of final stage, and derived for efficiency enhancing. On the other hand, analytical solutions based on different conservation laws...

... to enhance the spreadability of the material. FTIR and Raman spectroscopy confirmed the presence of a variety of oxygen functional groups at the edges and basal plane of the functionalized graphite nanoplatelets, which contributed to improved interaction with the polymer matrix. A comparative statistical...

... the overall effectiveness of the TIM. Although significant amount of work has been done on understanding the thermal and moisture effects of various polymer materials used in microelectronic package assemblies, very limited work has been done to study the effect of temperature and moisture on TIM delamination...

..., the numerical results indicated a ratio of conductivity of filler to matrix for achieving the maximum thermal conductivity. composite materials electronics packaging finite element analysis polymers thermal conductivity composite materials thermal analysis encapsulant underfill finite element...

...Anthony J. Rafanelli Electrical Properties of Polymers ,by Riande Evaristo Diaz-Calleja Ricardo . Marcel-Dekker, Inc. , New York, NY, 2004, 630 pp., $195.00 , ISBN: 0-8247-5346-1 polymers electric properties dielectric properties With today’s material technologies...

... 10 2006 electronics packaging integrated optoelectronics polymers stochastic processes surface emitting lasers viscoelasticity uncertainty stochastic characterization photonic system epoxy viscoelastic behavior dynamic mechanical analysis Monte Carlo simulation...

... that specific steps, such as polymer support ring formation, could be employed to eliminate impact of wrinkling on the process of developing the 5 mm cube prototypes. As the demand for low cost, highly miniaturized electronics increases, 3D packaging has emerged as a high potential solution, particularly...

...M. Bahrami; M. M. Yovanovich; E. E. Marotta A compact analytical model is proposed for predicting thermal joint resistance of rough polymer-metal interfaces in a vacuum. The model assumes plastic deformation at microcontacts and joint temperatures less than the polymer’s glassy temperature...

...Man-Lung Sham; Jang-Kyo Kim Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package when the polymer is cooled from the curing temperature to ambient, from which...

... effect. 14 07 2004 03 11 2004 plastic packaging integrated circuit packaging transfer moulding encapsulation polymers integrated circuit modelling Wire Density Effect Wire Sweep Mold-Filling Analysis Transfer Molding Plastic Packaging of ICs Plastic Encapsulation...

... circuit testing polymers High pin count and high-density electronics continue to push electronic packaging materials to their limits. The next generation of high performance packages such as multichip modules, flip-chip, chip scale ball grid array, etc., requires low cost, high density, and high...

... devices polymers dielectric materials fracture delamination thermal stress cracking aluminium silicon To fabricate interconnect bump with BCB passivation, the adhesion promoter (AP3000 [Vinyltriacetoxysilane]) and BCB (Cyclotene™ 4024) were spin-coated on p-type (100) Si substrates...

... for each constituent are taken into account in the modeling. integrated circuit packaging moulding polymers internal stresses thermal stresses finite element analysis creep viscoelasticity McSkimin , H. J. , and Andreatch , P. , 1964 , “ Elastic Moduli of Silicon vs...

.... Courtois. 15 February 2001 08 April 2002 10 06 2003 encapsulation flip-chip devices microwave heating polymers curing delamination voids (solid) This paper discusses a new method for rapid curing of encapsulants such as underfills in flip-chips using variable...

..., which can cause failure due to solder joint fatigue. Other advantages of underfills include protection of the die from moisture, ionic contaminants, mechanical pull, shear, twist, shock and vibration; Lau, 1 2 . integrated circuit packaging curing polymers flip-chip devices encapsulation...

...Bernd Michel,, Guest Editor, Poly’2000 Co-chair; Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair 12 12 2002 reliability polymers adhesion adhesives plastic packaging integrated circuit packaging fracture mechanics stress effects thermal management (packaging...

... , S. V. , and Lee , L. J. , 1973 , “ Analysis of Volumetric Changes of Unsaturated Polyester Resins During Cure ,” Polym. Eng. Sci. , 35 ( 10 ), pp. 852 – 859 . Kamal , M. R. 1973 , “ Kinetics and Thermal Characterization of Thermoset Cure ,” Polym. Eng. Sci. , 13 , p. 59 59...

... circuit packaging integrated circuit reliability swelling moisture failure analysis stress analysis reflow soldering sensitivity analysis polymers Polymeric materials swell upon absorbing moisture. Differential swelling occurs between the polymeric and nonpolymeric materials, as well...

...Qizhou Yao; Jianmin Qu Debonding of polymer-metal interfaces often involves both interfacial and cohesive failure. Since the cohesive strength of polymers is usually much greater than the polymer-metal interfacial strength, cohesive failure near the interface is usually desired for enhancing...

...L. J. Ernst; C. van ’t Hof; D. G. Yang; M. S. Kiasat; G. Q. Zhang; H. J. L. Bressers; J. F. J. Caers; A. W. J. den Boer; J. Janssen Thermo-setting polymers are widely used as underfill materials to improve the reliability of electronic packages. In the design phase, the influence of underfill...