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Keywords: plastic deformation
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 120–128.
Published Online: October 4, 2006
... alloys plasticity eutectic alloys indentation elastic deformation plastic deformation hardness testing integrated circuit packaging Length scale, nanoindentation, strain gradient plasticity, size effects It has been observed that response of many metals and its alloys...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 273–281.
Published Online: October 6, 2004
...Samuel I-En Lin Thermal residual plastic deformation of bond joints on thin film based DWDM module under thermal cycles loading was investigated using three-dimensional finite element analysis. Finite element simulations were carried out to investigate the effect of the 4 and 6 solder-joint designs...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 367–373.
Published Online: October 6, 2004
... Editor: Guo-Quon Lu. 01 December 2003 01 March 2004 06 10 2004 solders thermomechanical treatment tin alloys silver alloys copper alloys plastic deformation viscoplasticity electronics packaging finite element analysis failure analysis Due to environmental...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 256–264.
Published Online: July 8, 2004
... military avionics life testing creep plastic deformation ball grid arrays With the dramatic advances made in commercial electronics for computing, telecommunication, and other applications, it is increasingly beneficial to use such commercial electronics in military applications for improved...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 135–141.
Published Online: April 30, 2004
... solders cracks semiconductor device packaging viscoplasticity plastic deformation fracture internal stresses Solder joint integrity is recognized as a key issue in the reliability of Flip Chip (FC) and Ball Grid Array (BGA) Integrated Circuit (IC) Packages. In a flip chip package...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 82–86.
Published Online: April 30, 2004
... of stability of the compressive force at the contact face between a chip bump and a substrate pad. The key factor that dominates the interconnection reliability during temperature cycling is the amount of plastic strain in the chip bump (gold bump) at the contact face. The plastic deformation of the chip bump...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 84–92.
Published Online: March 14, 2003
... by the EPPD Division, January 25, 2002; revised manuscript received March 15, 2002. Associate Editor: D. T. Read. 25 January 2002 15 March 2002 14 03 2003 tin alloys lead alloys flip-chip devices chip-on-board packaging soldering thermal stress cracking plastic deformation...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 234–239.
Published Online: July 26, 2002
... scale packaging plastic deformation ball grid arrays flip-chip devices fatigue ductility stress-strain relations lead bonding integrated circuit interconnections finite element analysis Wafer Level Packaging Chip Scale Package Wire Interconnect Technology The function and design...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 91–96.
Published Online: May 2, 2002
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD May 29, 2001. Associate Editor: B. Michel 29 May 2001 02 05 2002 eutectic alloys tin alloys lead alloys soldering plastic deformation recovery-creep integrated circuit packaging slip dislocation climb grain...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 27–36.
Published Online: March 13, 2001
... on the numerical results. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received at ASME Headquarters March 13, 2001. Associate Editor: Y. C. Lee. 13 March 2001 plastic deformation hardness lead bonding...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 238–246.
Published Online: December 12, 2000
... Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received at ASME Headquarters December 12, 2000. Associate Editor: Y. Pao. 12 December 2000 tin alloys silver alloys soldering creep plastic deformation packaging There has been growing...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2001, 123(4): 405.
Published Online: September 19, 2000
... OF MECHANICAL ENGINEERS . Manuscript received by the EPPD September 19, 2000. Associate Editor: B. Michel. 19 September 2000 flip-chip devices thermal stress cracking copper plastic deformation soldering Formation of solder bumps for flip chips may cause cracks in the chip around...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 254–259.
Published Online: August 30, 2000
... . Manuscript received by the EEPD January 27, 1998; revised manuscript received August 30, 2000. Associate Editor: D. Read. 27 January 1998 30 August 2000 machining brittleness cutting indentation plastic deformation integrated circuit manufacture stochastic processes...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 74–78.
Published Online: June 29, 2000
... 29 June 2000 tin alloys lead alloys eutectic alloys soldering fatigue plastic deformation finite element analysis Tin (Sn)–lead (Pb) alloys with near eutectic compositions have been widely used as soldering materials in the package of semiconductor and communication devices...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 306–310.
Published Online: June 20, 2000
... mechanics circuit reliability printed circuits plastic deformation thermal stress cracking crack-edge stress field analysis delamination soldering finite element analysis The last decade witnessed an explosive growth in the research and development efforts devoted to solder bumped flip chips...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 121–127.
Published Online: November 29, 1999
.... 29 November 1999 packaging thermal expansion finite element analysis thermal stresses plastic deformation Almost all electronic packages and assemblies contain components made of dissimilar materials having anisotropic time-dependent and temperature-dependent properties...