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Keywords: numerical analysis
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031002.
Published Online: September 14, 2011
... Time to Failure for Solder Joint of a Wafer Level Chip Scale Package ”, IEEE Trans. Compon. Packag. Technol. , 33 ( 3 ), pp. 544 – 552 . 10.1109/TCAPT.2010.2044576 current density electromigration electronics packaging failure analysis numerical analysis reliability sensitivity...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021004.
Published Online: June 23, 2011
... always higher than that made from SAC105 no matter on Cu or electroless Ni. Moreover, the fracture was found at the interface between the Cu foil and epoxy in the halogen-free test device. Numerical analysis showed that the thickness of IMC layer dominated the pull strength of the solder joint because...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021002.
Published Online: May 20, 2010
... ) row 6, ( c ) row 12, and ( d ) row 13 21 04 2009 17 02 2010 20 05 2010 20 05 2010 air conditioning computer centres numerical analysis data center air flow distribution CRAC modeling numerical modeling Schmidt , R...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031010.
Published Online: July 31, 2009
... 2008 22 03 2009 31 07 2009 diffusion integrated circuit packaging moisture numerical analysis vapour pressure direct concentration approach (DCA) moisture diffusion vapor pressure reflow electronic package multiscale analysis Fan , X. J. , 2005/2006...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031012.
Published Online: July 31, 2009
... Moretti , S. , 2007 , “ Numerical Analysis on Heat Removal From Y-Shaped Fins: Efficiency and Volume Occupied for a New Approach to Performance Optimisation ,” Int. J. Therm. Sci. 1290-0729 , 46 ( 6 ), pp. 573 – 579 . 10.1016/j.ijthermalsci.2006.08.004 Lorenzini , G. , and Moretti...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011005.
Published Online: February 12, 2009
... Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die,” InterPACK 2005, San Francisco, CA, Jul. 17–22 ) has been done, which includes numerical analysis and thermal based optimization of a typical package consisting of a nonuniformly powered die, heat spreader, thermal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011001.
Published Online: February 11, 2009
... Conditions—Natural Convection (Still Air) ,” EIA/JESD51-2. ball grid arrays chip scale packaging circuit reliability numerical analysis thermal analysis Eighth-symmetry finite element model Calibration experiment setup Time histories of T j and T b...
Journal Articles
Article Type: Technology Review
J. Electron. Packag. September 2008, 130(3): 034001.
Published Online: July 30, 2008
...) detailed numerical analysis models directly connected to optimization algorithms, (2) design of experiments (DoE), and (3) artificial neural networks (ANNs) have been proposed as new trends in this field. These methodologies have led to significant improvement in design optimization capabilities, while...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011009.
Published Online: February 12, 2008
... , Precis. Eng. 0141-6359 10.1016/S0141-6359(02)00182-4 , 27 , pp. 42 – 50 . Brakke , K. A. , Surface Evolver Manual, Version 2.20, Susquehanna University, 2003 . numerical analysis optoelectronic devices scanning electron microscopes soldering solders surface tension...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 115–124.
Published Online: January 19, 2006
... equation ballistic transport thermal conductivity phonon dispersion relations numerical analysis Thermal properties of vitreous silica at 300 K ( 9 ) Property Value Units Acoustic velocity (longitudinal), v g 5800 m∕s Density of states, η 6.61...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 18–24.
Published Online: March 21, 2005
... presents a fundamental concept and principles of resin self-alignment processes. The numerical analysis is conducted to enhance understandings of resin self-alignment behavior and the relationship between process-related parameters. It was proved that resin self-alignment is different from the oscillatory...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 528–534.
Published Online: January 24, 2005
... , 1992, Flomerics Ltd., Surrey, U.K. heat sinks multichip modules heat transfer thermal analysis flow simulation jets optimisation numerical analysis 1 Schematic diagram of the flow-through heat sink 2 Schematic diagram of the impingement heat sink 3 Schematic...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 423–428.
Published Online: January 24, 2005
... . Calmidi, V. V., and Sathe, S. B., 2000, “Numerical Analysis of Buoyancy-Induced Flow and Heat Transfer in an Enclosure With Vents,” HTD-Vol. 366-4, Proc. of ASME Heat Transfer Division-2000 , ASME, New York, Vol. 4, pp. 407–411. Ishizuka , M. , 1998 , “ The Effect of the Outlet Area and the...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 477–490.
Published Online: January 24, 2005
... systems heat transfer thermal analysis numerical analysis Integrated Power Electronics Reduced Thermal Model Lumped Thermal Capacitance 10 Experimental test bed for the low-speed thermal response experiment: ( a ) schematic of experiment and ( b ) picture of actual setup 11...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 535–540.
Published Online: January 24, 2005
... modulation optical communication equipment thermal resistance numerical analysis 1 Cross-section of 1480 nm modulating pump laser (Kimura et al. 1 ) 2 Laser diode and thermal carrier 3 Detailed description of the laser diode structure 4 Minimum and maximum...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 546–553.
Published Online: January 24, 2005
.... Patankar, S. V., 1980, Numerical Heat Transfer and Fluid Flow , Hemisphere, New York. thermal management (packaging) chip scale packaging natural convection thermal analysis laminar flow coolants water numerical analysis surface mount technology 5 Selection of exponent n for...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 429–434.
Published Online: January 24, 2005
... No. 557-020 Ed. No. 1, FLIR Systems, Inc., Danderyd, Sweden, 1994. electronics packaging thermal resistance thermal conductivity radio equipment lead bonding thermal analysis microassembling numerical analysis 1 QFN package thermal trends ( Rja vs body size) 2...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 510–518.
Published Online: January 24, 2005
...-15728, pp. 905–914. Flotherm Instruction Manual , Flomerics Ltd., UK. electronics packaging HVAC heat transfer computational fluid dynamics compressible flow flow simulation turbulence numerical analysis 1 Equipment power density trends 2 Layout of data center...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 141–146.
Published Online: August 9, 2004
... microfluidics micromachining channel flow electrophoresis osmosis numerical analysis mixing Schematic of regular and proposed microchannels driven with EOF: (a) regular microchannel for fluid pumping; (b) proposed fluid pumping microchannel with mixing enhancement Fabrication process of...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 186–194.
Published Online: July 8, 2004
... Process of Resin Transfer Molding ,” J. Reinf. Plast. Compos. , 14 ( 4 ), pp. 310 – 332 . solders flow through porous media plastic flow permeability numerical analysis flip-chip devices flow simulation 10 Comparisons of experimental and simulation flow-front shape by Han 2 3...