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Keywords: natural convection
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041005.
Paper No: EP-13-1106
Published Online: September 19, 2014
... a small heat sink which is barely capable of dissipating heat for 60 W equivalent LED bulbs with natural convection for today's LED efficacies. 75 W and 100 W equivalent bulbs require larger sizes, some method of forced cooling, or some unusual liquid cooling system; generally none of these approaches...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2012, 134(3): 034501.
Published Online: July 24, 2012
... measurements and the analyses, enclosures without fins (“bare” enclosures) are also prepared and tested. Surface temperature distribution is determined for various enclosure lengths and heat generation rates. Existing relationships for natural convection and radiation heat transfer are used to calculate...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011010.
Published Online: March 10, 2011
... natural convection between the heated electronic components mounted on the left and right vertical walls with a relatively lower temperature. The results of a CFD simulation are used to train and validate a series of ANN architectures, which are developed to quickly and accurately carry out this analysis...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011003.
Published Online: March 3, 2011
... model for the SFP is constructed and calibrated using a natural convection experiment. The calibrated detailed model is used for generating the limited boundary-condition-independent compact thermal model (CTM). Limited boundary-condition-independence, in this case, refers only to a small subset of all...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2009, 131(1): 014501.
Published Online: February 12, 2009
...G. De Mey; M. Wójcik; J. Pilarski; M. Lasota; J. Banaszczyk; B. Vermeersch; A. Napieralski; M. De Paepe The thermal impedance Z th ( j ω ) has been measured for the junction of a transistor mounted on a cooling fin. The setup was put inside a chimney in order to enhance the natural convection...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011006.
Published Online: January 31, 2008
..., such as the manufacturing cost and the design freedom. More importantly, this study has provided a further step in the direction of demonstrating the opening effect. 19 01 2007 07 06 2007 31 01 2008 computational fluid dynamics cooling natural convection substrates CFD experimental opening...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 370–379.
Published Online: December 24, 2005
...Ta-Wei Lin; Ming-Chang Wu; Cheng-Hsien Peng; Po-Li Chen; Ying-Huei Hung Thermal characteristics for a horizontal heated chip mounted with three types of nominally flat silicon-based heat spreaders have been systematically investigated. They include the natural convective and radiative heat transfer...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 157–165.
Published Online: September 28, 2005
...Peter M. Teertstra; M. Michael Yovanovich; J. Richard Culham An analytical model is developed for natural convection from a single circuit board in a sealed electronic equipment enclosure. The circuit card is modeled as a vertical isothermal plate located at the center of an isothermal, cuboid...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 423–428.
Published Online: January 24, 2005
... of the fan present serious concerns as the air velocity is increased to enhance the cooling capacity. Thus, the interest in natural-convection air cooling is growing to take advantage of low noise and energy savings inherent in that cooling mode. One method of promoting the capacity of natural air cooling...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 449–456.
Published Online: January 24, 2005
... , by 6% in natural convection and by 25% in forced convection. (v) An overmolded die with a heat spreader provides better a thermal enhancement than a heat spreader on a bare die for freestream velocities up to about 1 m/s. Beyond 1 m/s, a heat spreader on bare die has better thermal performance...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 546–553.
Published Online: January 24, 2005
... range of laminar regimes with the Reynolds number, based on heat source length, from 800 to 2625. The effect of heat fluxes, coolant flow rates, and geometric parameters (such as chip configuration number) are investigated. The operation is extended to study the transient natural convection during...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 172–177.
Published Online: December 23, 2004
... that is instrumented with a thermocouple. The case-to-ambient thermal resistance under natural convection with the heat sink is 3.15 ° C ∕ W . Forced convection with the synthetic jets enables a power dissipation of 59.2 W at a case temperature of 70 ° C , resulting in a case-to-ambient thermal resistance of 0.76 ° C...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
Published Online: October 6, 2004
...Wen-Hwa Chen, ASME Fellow, Professor; Hsien-Chie Cheng, ASME Member, Associate Professor; Chih-Han Lin, Graduate Student The study explores the thermal performance of three-dimensional (3-D), vertically stacked multi-chip modules (the so-called MCM-V) in natural convection through finite element...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 215–222.
Published Online: August 9, 2004
... natural convection channel flow laminar flow water In the thermal management of high-power electronic chips, liquid cooling has been considered to replace air cooling as increasing power density makes it difficult to maintain reasonable chip wall temperatures to below 85 ° C . Although...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 245–254.
Published Online: June 26, 2004
... captured. 21 01 2003 26 06 2004 printed circuits printed circuit manufacture thermal management (packaging) natural convection ball grid arrays printed circuit testing surface mount technology With ever-reducing product development cycle times preventing extensive...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 14–21.
Published Online: April 30, 2004
...Randy D. Weinstein; Amy S. Fleischer; Kimberly A. Krug Natural convection and passive heat rejection from two independent heat sources maintained at different temperatures ( 60 ° C and 100 ° C above ambient) on single circuit boards (FR4 and copper clad FR4) are experimentally studied. The effect...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 208–216.
Published Online: June 10, 2003
... 2001 10 06 2003 natural convection heat sinks thermal management (packaging) thermal analysis optimisation specific heat integrated circuit packaging laminar flow Heat Sink Rectangular Plate-Fin Natural Convection Least-Material Optimization The exponential increase...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 200–207.
Published Online: June 10, 2003
.... The optimal aspect ratio for ducts with forced and natural convection corresponds to the special geometry and flow conditions where boundary layers meet just as the coolant exits the channel. This “constructal” design principle is illustrated by several classes of examples: laminar forced and natural...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 244–250.
Published Online: June 10, 2003
... is investigated in a control volume context with a collocated grid arrangement. The accuracy of the results obtained by both excluding and including the buoyancy term is evaluated through application to the natural convection heat transfer problem in a cavity at different Rayleigh numbers. Contributed...
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 419–426.
Published Online: December 12, 2002
..., the nonuniform case temperature of the handset was measured using an infrared (IR) camera, while thermocouples measured the temperatures of the PCM and simulated power amplifier (heater). Transient and steady-state heat transfer rates by natural convective and radiation from the handset to the environment were...