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Keywords: microsensors
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041009.
Published Online: November 12, 2009
... microsensors Taguchi methods glass cover chip CMOS image sensor Taguchi method packaging process Rapid technological advancements in the semiconductor field, combined with growing consumer demand for products with increasing levels of functionality and ever decreasing size, have resulted...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 286–289.
Published Online: August 4, 2004
... microsensors thermocouples heat conduction Seebeck effect Seebeck Coefficient Temperature Sensors Thermocouple Arrays Thin Film There are a number of ways to measure temperatures microscopically, including infrared thermography, liquid crystal thermography, thermistors, resistance...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 470–474.
Published Online: December 15, 2003
... Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received May 2001; final revision, June 2003. Associate Editor: Y. C. Lee. 01 May 2001 01 June 2003 15 12 2003 microsensors pressure sensors humidity environmental degradation finite element analysis...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 79–82.
Published Online: May 26, 2000
... May 26, 2000. Associate Editor: M. Shiratori. 09 September 1999 26 May 2000 microsensors temperature sensors pressure sensors reliability carbon fibre reinforced plastics surface mount technology Embedded Sensors MEMS Pressure Sensor Temperature Sensor Composites...