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Keyword: materials testing
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Journal Articles
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020902.
Published Online: June 7, 2011
... transfer materials testing thermal conductivity thermal interface materials carbon nanotubes thermal resistance Thermal interface materials (TIMs) are used in electronics packaging to increase heat conduction across the interface between two relatively flat surfaces. A good TIM will have...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 266–272.
Published Online: March 15, 2007
... reference for the choice of substrate materials and reliability design of PCBs when electronic products are devised. 21 01 2006 15 03 2007 materials testing printed circuit testing printed circuits substrates viscoelasticity PCB drop impact dynamic analysis viscoelasticity...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 41–47.
Published Online: May 18, 2006
... cyclic straining. 02 09 2005 18 05 2006 solders electronics packaging materials testing deformation tin alloys silver alloys solder alloy time-dependent deformation nonproportional loading viscoplasticity constitutive model strain rate sensitivity dwell time The...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 441–448.
Published Online: February 23, 2006
... 2005 23 02 2006 assembling surface mount technology printed circuit manufacture ball grid arrays chip scale packaging finite element analysis bending failure analysis solders materials testing reliability The increasing demand for smaller and faster products in the...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
Published Online: February 14, 2006
...) heat sinks adhesives contact resistance scanning electron microscopy radiography acoustic microscopy materials testing thermal interface materials interfacial resistance radiography SEM acoustic microscopy The joint between a thermal interface material (TIM) and a heat spreader...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 419–426.
Published Online: February 6, 2006
... beam-type geometry for the three-point or four-point bending test. 30 08 2005 06 02 2006 integrated circuit packaging materials testing surface roughness mechanical strength bending failure analysis silicon electronic packaging die strength test method failure mode...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 192–201.
Published Online: November 23, 2005
... metallisation materials testing shear deformation nucleation ductile fracture mechanical testing voids (solid) gold copper aluminium fractography shear fracture gold ball bond copper ball bond thermosonic bonding interface In integrated circuit (IC) chip manufacturing, wire bonding...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 232–236.
Published Online: July 8, 2004
... 2003 01 January 2004 08 07 2004 solders finite element analysis calibration materials testing electronics packaging differential scanning calorimetry The compendium paper (Part 1: Models and Testing) presents details of the thermomechanical-digital image correction (TM-DIC...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 100–105.
Published Online: April 30, 2004
... irreversible thermodynamics failure analysis finite element analysis materials testing failure (mechanical) Solder alloys have been extensively used in the electronic industry. The conventional approaches for electronic package reliability are based on empirical relations from laboratory testing...