1-20 of 26
Keyword: life testing
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
×Close Modal
Sort by
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2011, 133(3): 034501.
Published Online: September 14, 2011
... activation energy of 0.87 eV and a Peck parameter of 2.29. MTTF value of 1.582 × 10 6 h at low bias current, 10 mA, has been evaluated. 20 07 2010 19 05 2011 14 09 2011 14 09 2011 failure analysis life testing light emitting diodes semiconductor device reliability...
Journal Articles
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
Published Online: March 19, 2010
... circuit reliability integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability This book entitled “ Mechanical Design of Electronic Systems ” is written from a mechanical design perspective to introduce...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041001.
Published Online: October 16, 2009
... packaging leak detection life testing micromechanical devices pressure sensors vacuum techniques vacuum packaging molecular flow leak rate MEMS packaging Much research on vacuum packaging was focused on the electronic vacuum tube packaging before MEMS emergence ( 1 2 3 4 ). Novel...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
... finite element analysis integrated circuit interconnections integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys As technology progresses, both consumer and military products are making greater use of electronics...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041005.
Published Online: November 17, 2008
.... 25 07 2005 19 03 2008 17 11 2008 delamination electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment Underfill materials are used in flip chip...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... integrated circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling Solder joint fatigue has been the subject of a great...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 144–148.
Published Online: June 13, 2006
... (internal package volume), equivalent leak rates, and equivalent size of interconnected defects in the bonding zone. 16 08 2005 13 06 2006 micro-optomechanical devices electronics packaging encapsulation hermetic seals life testing Optical microelectro mechanical systems (MOEMS...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 56–62.
Published Online: May 19, 2006
...Yi-Shao Lai; Chiu-Wen Lee; Chin-Li Kao The high-temperature operation life test (HTOL) was conducted in this paper to study electromigration phenomena of solder interconnects in a flip-chip package assembly. We examined the fatigue reliability and morphological patterns of three solder compositions...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 28–34.
Published Online: May 1, 2006
... plastic packaging computational fluid dynamics ball grid arrays flip-chip devices reliability temperature distribution life testing solders finite element analysis power cycling FEA CFD flip chip PBGA ATC ANSYS ICEPAK Fatigue failure of solder interconnect is a major...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 339–345.
Published Online: January 8, 2006
...Sony Mathew; Diganta Das; Michael Osterman; Michael Pecht; Robin Ferebee This paper presents an analysis of an unexpected failure during vibration and shock life test of an electronic circuit board that has been in use for more than 15 years. During testing, an aluminum bracket used to mount a...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 96–105.
Published Online: June 3, 2005
... three-parameter Weibull distributions with life test data of an 1657-pin CCGA package with the 95.5 wt %Sn3.9 wt %Ag0.6 wt %Cu lead-free solder paste on lead-free printed circuit boards under thermal cycling conditions. The other part of this study is to determine the time-history creep strain energy...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 407–414.
Published Online: December 24, 2004
... 2004 electronics packaging fatigue testing solders life testing shear strength creep testing ductility tin alloys lead alloys Solders have been used as a connection material between electric parts. They receive low cycle fatigue damage during on/off switching caused by the...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 390–397.
Published Online: October 6, 2004
... metallisation fatigue tensile testing humidity life testing A common failure mechanism of polyimide dielectric is deadhesion by aging-assisted fatigue. Fatigue crack growth results from thermo-mechanical and hygroscopic stresses induced by changes in the temperature and humidity of the local...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 398–405.
Published Online: October 6, 2004
... scale packaging life testing solders electronics packaging cracks stress effects finite element analysis There are many types of thermal fatigue models for determining the solder joint reliability of electronic packages, each with its own merits 1 . These models are dependent on package...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 256–264.
Published Online: July 8, 2004
... military avionics life testing creep plastic deformation ball grid arrays With the dramatic advances made in commercial electronics for computing, telecommunication, and other applications, it is increasingly beneficial to use such commercial electronics in military applications for improved...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 1–3.
Published Online: March 14, 2003
... the Electronic and Photonic Packaging Division and presented at Poly 2000, London, United Kingdom, December 4-5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 14 03 2003 reliability life testing Weibull...
Journal Articles
Article Type: Announcements
J. Electron. Packag. December 2002, 124(4): 432.
Published Online: December 12, 2002
... 12 12 2002 reliability failure analysis life testing electronic equipment testing telecommunication standards product liability design engineering First Call for Papers: International IEEE Conference on the Business of Electronic Product Reliability and Liability...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 184–187.
Published Online: July 26, 2002
... absorption and diffusion through the polymeric underfill, and the resulting hygromechanical viscoplastic stress history. The simulations are combined with accelerated aging tests to assess in-service durability in hot, humid environments. Model predictions are compared with results of accelerated life tests...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 205–211.
Published Online: July 26, 2002
.... Associate Editor: Yi-Hsin Pao. 09 August 2000 26 07 2002 reflow soldering flip-chip devices creep chip scale packaging printed circuit manufacture integrated circuit reliability life testing integrated circuit testing By IPC’s definition, holes with 6 mils (0.15 mm) or...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 170–177.
Published Online: July 26, 2002
...E. Suhir, ASME Fellow Drop tests are often substituted in qualification or life testing of microelectronic and optoelectronic products by shock tests. The existing (e.g., Telcordia) qualification specifications require that a short term load of the given magnitude and duration (say, an “external...