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Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021010.
Published Online: May 15, 2008
... of the constituents in the assembly system, have been observed by means of a multifunction macro-micro-moiré interferometer, whereby the displacement distributions have been obtained and analyzed for the different specimens. The interconnect layer is usually of smaller size as compared to the...