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Keywords: integrated logic circuitsClose
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011005.
Published Online: February 12, 2009
...) , Reference Manual. integrated circuit packaging integrated logic circuits microprocessor chips numerical analysis temperature distribution Impact of die power nonuniformity on cooling capability ( 9 ) Schematic of a given attachment ( 11 12 ) Schematic of a two-layer body...