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Keywords: integrated circuit manufacture
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011012.
Published Online: February 14, 2008
... important design recommendations in terms of solder joint location as well as heat sink attachment. 04 12 2006 30 07 2007 14 02 2008 ball grid arrays ceramics integrated circuit manufacture solders vibrations The low-cycle fatigue failure of solder joints due...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011001.
Published Online: January 31, 2008
... circuit manufacture printed circuits solders Taguchi methods wafer level packaging temperature cyclic loading Taguchi method lead-free solder wafer level chip scale package (WLCSP) Owing to the mismatch of coefficient of thermal expansion (CTE) between the chip and printed circuit...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 391–399.
Published Online: November 28, 2006
... 2006 active networks cracks electrical faults finite element analysis friction integrated circuit bonding integrated circuit manufacture lead bonding stress analysis A higher level of circuitry integration is the primary driving force for the semiconductor industry. Increasing...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 340–352.
Published Online: December 10, 2004
... the nominal volume of paste to be deposited is kept constant. The second phase consists of developing a model that predicts paste-release efficiencies from small apertures and validating the model with experimental results. 09 02 2004 10 12 2004 assembling soldering integrated circuit...
Topics: Printing, Solders
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
Published Online: December 2, 2004
..., it was found that higher-order elements, such as hexahedra or prisms, are more suitable than tetrahedra. 19 04 2004 02 12 2004 integrated circuit manufacture plastic packaging electronics packaging encapsulation moulding mass production Paddle Shift Mold-Filling Analysis Transfer...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 177–185.
Published Online: July 8, 2004
... PACKAGING . Manuscript received February 2003; final revision, November 2003. Associate Editor: M. Saka. 01 February 2003 01 November 2003 08 07 2004 silicon elemental semiconductors grinding finite element analysis integrated circuit manufacture Semiconductor wafers...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 255–261.
Published Online: June 24, 2004
... integrated circuit manufacture electronics packaging classical mechanics The past decade has been marked by a substantial evolution in the proper understanding and modeling of the mechanics of materials at small length scales. The ongoing miniaturization, which has driven the technological...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 254–259.
Published Online: August 30, 2000
... . Manuscript received by the EEPD January 27, 1998; revised manuscript received August 30, 2000. Associate Editor: D. Read. 27 January 1998 30 August 2000 machining brittleness cutting indentation plastic deformation integrated circuit manufacture stochastic processes...