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Keywords: flow through porous media
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Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034501.
Published Online: June 12, 2009
... 11 2007 18 02 2009 12 06 2009 convection flow through porous media metal foams convection heat sink metal foam graphite foam electronics cooling Commercially produced metal foams are typically made from aluminum, nickel, steel, copper, and some of their alloys...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 342–350.
Published Online: October 6, 2004
... 01 Feb 2004 06 10 2004 heat sinks flow through porous media permeability aluminium convection Today’s trend in the electronic equipment industry toward denser and more powerful products requires a higher level of performance from cooling technology. Many ideas for cooling...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 247–255.
Published Online: July 8, 2004
... for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received May 2003; final revision, December 2003. Associate Editor: B. Sammakia. 01 May 2003 01 December 2003 08 07 2004 heat transfer heat sinks flow through porous media forced convection electronics packaging...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 186–194.
Published Online: July 8, 2004
.... 01 April 2003 01 November 2003 08 07 2004 solders flow through porous media plastic flow permeability numerical analysis flip-chip devices flow simulation Flip chip interconnects are being used in the electronics industry and have inherent advantages over other...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 223–234.
Published Online: May 8, 2004
... 08 05 2004 heat conduction porous materials aluminium foams air forced convection heat sinks modelling flow through porous media Porous Metallic Foam Heat Sink Single Blow Method Transient Liquid Crystal Method Nusselt Number Reynolds Number The analysis of heat...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 251–260.
Published Online: June 10, 2003
.... Culham. 12 October 2001 10 06 2003 heat pipes capillarity two-phase flow evaporation undercooling flow separation flow through porous media thermal conductivity pipe flow The concept of the capillary pumped loop (CPL) first appeared thirty years ago during the initial...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 155–163.
Published Online: July 26, 2002
...) forced convection thermal resistance foams porous materials flow through porous media boundary layers cooling aluminium The large-scale integration of electronic circuits has resulted in a continuous increase in chip power dissipation requirements. According to the SIA roadmap 1...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 274–278.
Published Online: July 11, 1999
... (packaging) heat sinks cooling forced convection flow through porous media Green's function methods Studies on convective heat transfer and fluid flow in porous media have been motivated by a broad range of applications, including geothermal system, thermal insulation, heat pipes, etc. Recently...