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Keywords: flow through porous media
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Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034501.
Published Online: June 12, 2009
..., the disagreements are not due to omitting the fluid conduction in the current analysis. Comparison to Lee and Vafai ( 8 ) for κ = 0.01 and various Bi 21 11 2007 18 02 2009 12 06 2009 convection flow through porous media metal foams convection heat sink metal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 342–350.
Published Online: October 6, 2004
... through porous media permeability aluminium convection Today’s trend in the electronic equipment industry toward denser and more powerful products requires a higher level of performance from cooling technology. Many ideas for cooling methods have been proposed—among them is the pin fin heat...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 247–255.
Published Online: July 8, 2004
... 01 December 2003 08 07 2004 heat transfer heat sinks flow through porous media forced convection electronics packaging permeability flow simulation aluminium temperature distribution The trend in electronics industry toward smaller and more powerful products has...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 186–194.
Published Online: July 8, 2004
... for flip chip technology. solders flow through porous media plastic flow permeability numerical analysis flip-chip devices flow simulation 01 April 2003 01 November 2003 08 07 2004 Contributed by the Electronic and Photonic Packaging Division for publication...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 223–234.
Published Online: May 8, 2004
... liquid crystal method 08 04 2004 08 05 2004 heat conduction porous materials aluminium foams air forced convection heat sinks modelling flow through porous media Porous Metallic Foam Heat Sink Single Blow Method Transient Liquid Crystal Method Nusselt Number...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 251–260.
Published Online: June 10, 2003
.... Culham. 12 October 2001 10 06 2003 heat pipes capillarity two-phase flow evaporation undercooling flow separation flow through porous media thermal conductivity pipe flow The control of operating temperature, regardless of power input, makes future use of CPL systems...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 155–163.
Published Online: July 26, 2002
...) forced convection thermal resistance foams porous materials flow through porous media boundary layers cooling aluminium The large-scale integration of electronic circuits has resulted in a continuous increase in chip power dissipation requirements. According to the SIA roadmap 1...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 274–278.
Published Online: July 11, 1999
... agreements are achieved. [S1043-7398(00)01503-6] thermal management (packaging) heat sinks cooling forced convection flow through porous media Green's function methods Studies on convective heat transfer and fluid flow in porous media have been motivated by a broad range of applications...