1-8 of 8
Keywords: finite volume methods
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
Published Online: November 24, 2010
... 24 11 2010 aluminium boundary layers computational fluid dynamics contact resistance convection finite volume methods heat sinks metal foams With the development of new high power-density electronics arises the need for more effective means of dissipating the excess heat...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021005.
Published Online: April 1, 2009
... of variance and regression analysis Order of polynomial R 2 R adj 2 RMSE 2 0.9691 0.9559 1.7 × 10 − 3 12 09 2007 07 01 2009 01 04 2009 finite volume methods heat sinks heat transfer laminar flow microchannel flow...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
Published Online: March 27, 2009
... the heat sink itself can be considered a high-conductivity porous medium. In Fig. 9 , we find an increase of more than one order of magnitude in pressure drop due to the addition of the aluminum foam to the finned channels. aluminium computational fluid dynamics finite volume methods forced...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021004.
Published Online: April 25, 2008
.... This model can handle local thermal nonequilibrium condition between the PCM and the solid matrix. The numerical model is based on volume averaging technique, and the finite volume method is used to discretize the heat diffusion equation. The findings show that, for steady heat generation, the shape...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 519–523.
Published Online: January 24, 2005
... by: B. Sammakia. 21 May 2004 19 July 2004 24 01 2005 heat sinks electronics packaging plates (structures) cooling convection jets nozzles flow simulation finite volume methods telecommunication Lee , D. Y. , and Vafai , K. , 1999 , “ Comparative...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 465–471.
Published Online: January 24, 2005
.... Sammakia. 27 April 2004 31 May 2004 24 01 2005 electronics packaging cooling product design convection turbulence flow simulation finite volume methods Cooling of electronic components is one of the main barriers to developing faster, smaller, and more reliable...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 8–13.
Published Online: April 30, 2004
... February 2002 30 04 2004 thermal energy storage finite volume methods product design correlation methods Many multi-chip modules such as portable electronic devices have variable power dissipation rates. As a consequence, conventional electronics module coolers must be designed...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 200–210.
Published Online: September 3, 1999
.... Associate Editor: R. Wirtz. 03 September 1999 packaging finite volume methods heat transfer convergence of numerical methods temperature distribution thermodynamics Cabinets Numerical Simulation Experimental Validation Volume Element Model In the field of heat transfer...