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Keywords: fatigue testing
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041010.
Published Online: December 3, 2010
... in the tensile region is different from that in the compressive region is employed for the fatigue test. Different fatigue lives due to different strain rates in the tensile and compression regions originate from the difference of development behaviors of creep strain generated in the cyclic loading...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
...-Free and Mixed Assembly Solder Joint Reliability Trends ,” Proceedings of IPC/SMEMA APEX 2004 Conference , Anaheim, CA, Feb. 21–26. Sandstrom , R. , Osterberg , J. -O. , and Nylen , M. , 1993 , “ Deformation Behavior During Low Cycle Fatigue Testing of 60Sn–40Pb Solder ,” Mater. Sci...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041005.
Published Online: November 17, 2008
.... Packag. Technol. 1521-3331 10.1109/6144.926391 , 24 ( 2 ), pp. 256 – 264 . delamination electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... specimen. These profiles were used as isothermal boundary conditions in simulation. 05 01 2007 20 08 2007 15 04 2008 copper alloys creep fatigue cracks fatigue testing fracture mechanics integrated circuit interconnections integrated...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
...John H. L. Pang; F. X. Che Isothermal three-point and four-point cyclic bend fatigue test methods have been developed for Sn–Ag–Cu solder joints. Reported bend tests from the literature were conducted at room temperature (25°C) and there is lack of data for lead-free solder joints. In this study...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 427–433.
Published Online: February 13, 2007
... arrays electronics packaging fatigue testing heat treatment integrated circuit reliability light interferometry solders accelerated thermal cycling laser moiré interferometry Schematic of moiré interferometry ( 12 ) Moiré interferometry experimental setup U...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 405–411.
Published Online: October 4, 2006
... . Finite element model of the fatigue test specimen Comparison between finite element solution and analytical solution Rate of crack propagation Paris law for underfill delamination Optically visible interfacial delamination. (a) Sample when oriented parallel to view. (b...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 9–18.
Published Online: September 21, 2006
..., Maui, HI, July 6–11. Zhan , B. A. , “ Impact of Ball via Configuration on Solder Joint Reliability in Tape Based Chip Scale Packages ,” ChipPack, Inc. thermal management (packaging) solders printed circuits thermal expansion fatigue testing reliability finite element analysis...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 179–189.
Published Online: July 5, 2006
... circuit packaging durability fatigue testing fatigue cracks solders deformation Global and local models: ( a ) fpBGA; and ( b ) SBGA Reaction force histories for fpBGA: ( a ) proposed equivalent model; ( b ) actual solder joint; and ( c...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
... stress conditions were imposed to investigate the effects of multiaxial stresses on deformation behavior. The effects of frequency and temperature on cyclic deformation and fatigue facture were investigated for lead-free Sn 3.8 Ag 0.7 Cu and Sn – Pb eutectic solder. Fractography of fatigue tested samples...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 56–62.
Published Online: May 19, 2006
.../j.matchemphys.2003.07.013 , 82 ( 3 ), pp. 818 – 825 . flip-chip devices electromigration solders integrated circuit interconnections life testing fatigue testing reliability temperature distribution tin alloys copper alloys silver alloys current density electromigration solder bump...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 407–414.
Published Online: December 24, 2004
... Evaluation of 63Sn-37Pb Solder Under Push-Pull Creep-Fatigue,” Proc. 37th Symposium on Strength of Materials at High Temperatures, Japan Society of Materials Science , pp. 116 – 120 . electronics packaging fatigue testing solders life testing shear strength creep testing ductility tin alloys...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 237–244.
Published Online: May 26, 2004
...Tae-Sang Park; Soon-Bok Lee To give a proper and accurate estimation of the fatigue life of ball grid array (BGA) solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. Experiments were conducted with 63 Sn ∕ 37 Pb and Sn ∕ 3.5 Ag ∕ 0.75 Cu solder joints in room...
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 385–390.
Published Online: December 12, 2002
...Ki-Ju Kang; Seon-Ho Choi; Tae-Sung Bae Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from the...
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 403–410.
Published Online: December 12, 2002
... a commercial finite element code. In addition, isothermal fatigue tests have been performed to obtain the relationship between the number of cycle-to-failure and the strain energy density. Thus, by combining the finite element results and the isothermal fatigue test results, the average thermal...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. March 2002, 124(1): 60–66.
Published Online: March 15, 2001
... and Thermal Loading,” Ph.D dissertation, SUNY at Buffalo. Adams, P. J., 1986 “Thermal fatigue of Solder Joints in Micro-Electronic Devices,” MS thesis, Dept. of Mechanical Engineering, MIT. McDowell, D. L., Miller, M. P. and Brooks, D. C., 1994 Fatigue Testing of Electronic Materials , ASTM STP...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 48–54.
Published Online: September 3, 1999
... – 15 . Pan , T. Y. , 1991 , “ Thermal Cycling Induced Plastic Deformation in Solder Joints—Part Two: Accumulated Deformation in Through Hole Joints ,” IEEE Trans. Compon., Hybrids, Manuf. Technol. , 14 , pp. 824 – 832 . thermomechanical treatment fatigue testing thermal...