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Keyword: electronics packaging
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031011.
Paper No: EP-18-1099
Published Online: May 24, 2019
...: Ercan Dede. 31 10 2018 27 02 2019 thermal cycling mechanical cycling electronics packaging reliability accelerated testing fatigue life cycle Flip–chip packaging delivers several advantages over other packaging methods, including more compact packaging and improved...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041014.
Published Online: December 21, 2011
... 2011 21 12 2011 adhesive bonding copper electronics packaging elemental semiconductors gold plates (structures) shear strength silicon solders thermal stresses thin films tin bimaterial assembly interfacial shearing stress peeling stress shear compliance bond layer...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041013.
Published Online: December 19, 2011
...Etienne L. Bonnaud Reliable drop test simulations of electronic packages require reliable material characterization of solder joints. Mechanical properties of lead-free solder were here experimentally investigated for both monotonic and cyclic loading at different strain rates. With regards to the...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044502.
Published Online: December 9, 2011
... is obtained with a 3 dB bandwidth of about 15 GHz. 11 10 2010 31 08 2011 09 12 2011 09 12 2011 computational electromagnetics electronics packaging microstrip lines modules optical interconnections optical modulation optoelectronic devices semiconductor lasers...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041006.
Published Online: December 9, 2011
..., but time- and temperature-dependence. For simplification of the stress constitutive models, particularly for applications on electronic packaging can be found in literature, the time-dependent behavior could be neglected. Otherwise, the property only considered as a function of temperature can achieve...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041003.
Published Online: December 8, 2011
.... The results indicate that for the potted design, the dynamic response of the processor board is attenuated by the potting material. 14 12 2010 07 07 2011 08 12 2011 08 12 2011 electronics packaging thermal stresses transient analysis weapons Due to the highly...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044501.
Published Online: November 17, 2011
...Yongchang Lee; Cemal Basaran Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031013.
Published Online: September 30, 2011
... 2011 30 09 2011 30 09 2011 cooling electronics packaging integrated circuit interconnections printed circuits compact thermal, model Delphi, vias micro-vias genetic algorithms In 1996, the component-level thermal design was revolutionized by compact thermal model...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031004.
Published Online: September 14, 2011
... crack driving force in it and consequently alleviates the risk of the intermetallic compound layer fracturing. 05 02 2011 22 06 2011 14 09 2011 14 09 2011 electronics packaging failure analysis finite element analysis solders solder joint intermetallic compounds...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031006.
Published Online: September 14, 2011
...M. O. Özdemir; H. Yüncü The objective of this study is to predict numerically the optimal spacing between parallel heat generating boards. The isothermal boards are stacked in a fixed volume of electronic package enclosed by insulated lateral walls, and they are cooled by laminar forced convection...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031002.
Published Online: September 14, 2011
... density electromigration electronics packaging failure analysis numerical analysis reliability sensitivity analysis solders electromigration sensitivity analysis time-to-failure It is well known that, as the electronics industry continues to push for high performance and...
Journal Articles
Article Type: Guest Editorial
J. Electron. Packag. June 2011, 133(2): 020301.
Published Online: July 1, 2011
...Tarek Ragab, Dr.; Cemal Basaran, Dr. 03 04 2011 01 06 2011 01 06 2011 01 07 2011 01 07 2011 carbon nanotubes chirality electron field emission electronics packaging mechanical strength molecular dynamics method nanoelectronics semiconductor nanotubes...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021005.
Published Online: June 23, 2011
... able to correspond to profiles found in XRD database, showing that 304SS has face-centered cubic crystal lattice. The Ni strike technique is used as surface treatment to make 304SS bondable to other metals, such as silver (Ag), copper (Cu), and gold (Au), commonly used in electronic packaging. Cross...
Journal Articles
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020902.
Published Online: June 7, 2011
...Drazen Fabris; Michael Rosshirt; Christopher Cardenas; Patrick Wilhite; Toshishige Yamada; Cary Y. Yang Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages and reduce high temperatures. TIMs are generally composed of highly conductive particle...
Journal Articles
Article Type: Guest Editorial
J. Electron. Packag. March 2011, 133(1): 010301.
Published Online: March 10, 2011
...Marta Rencz 10 03 2011 10 03 2011 cooling electronics packaging heat transfer microchannel flow Microelectronics thermal experts from four continents met in the fall of 2009 at the 15th THERMINIC Workshop in Leuven, Belgium. The event was sponsored by the IEEE Computer...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011009.
Published Online: March 10, 2011
... output only about 3% lower than that of the FTWL package. 17 11 2009 08 11 2010 10 03 2011 10 03 2011 electronics packaging light emitting diodes phosphors silicon compounds light emitting diode correlated color temperature color-rendering index total internal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011010.
Published Online: March 10, 2011
... dynamics cooling copper electronics packaging laminar flow nanofluidics natural convection neural nets two-phase flow There has been a significant growth in the use of nanofluids in various industrial applications due to their enhanced thermophysical properties. Wong and De Leon ( 1...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011005.
Published Online: March 9, 2011
... basic theory is briefly exposed and the method is applied to some two-layer virtual structures. The obtained results are compared with those obtained using standard FEM analyses. 30 11 2009 18 01 2011 09 03 2011 09 03 2011 electronics packaging finite element analysis power...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011003.
Published Online: March 3, 2011
...Arun Prakash Raghupathy; John Janssen; Attila Aranyosi; Urmila Ghia; Karman Ghia; William Maltz In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called small form-factor pluggable device (SFP). This is done using the...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041015.
Published Online: December 9, 2010
... 10 2010 09 12 2010 09 12 2010 diamond electronics packaging II-VI semiconductors thermal conductivity wide band gap semiconductors zinc compounds hybrid (A) polymer-matrix composites (PMCs) (A) thermal properties (B) electron microscopy (D) The constant demands...