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Keyword: deformation
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041007.
Published Online: December 9, 2011
... with the peak reflow temperature of lead-free (Pb-free) solders used in electronic industries. The Ag foil is quite soft and ductile. It can deform to mate with the Au surface on alumina. Thus, only 1000 psi of static pressure is needed to bring Ag atoms and Au atoms within atomic distance on the...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031009.
Published Online: September 23, 2011
... the crystallographic texture. However, very little intergranular rotation was observed over the range of thermomechanical conditions, suggesting the dominance of a grain boundary sliding (GBS) deformation mechanism. Finally, a recently developed unified-creep-plasticity constitutive model for solder...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
Published Online: March 27, 2009
...-dependent strains, the values of the material constants in the elasto-plastic-creep model proposed by the authors are determined. Simulations of the viscoplastic deformations of a Sn–3.0Ag–0.5Cu solder alloy are also conducted to verify the validity of the proposed method. 09 05 2008 26 11 2008...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
Published Online: November 17, 2008
... different coefficients of thermal expansion of each component make the package deform differently compared to the case of ATC. Traditionally, reliability assessment is conducted by ATC because ATC is believed to have a more severe thermal loading condition compared to PC, which is similar to the actual...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031006.
Published Online: July 30, 2008
... at the closed end of the gel was attenuated by the resulting deformation in the gel. The resulting pressure profile obeys equations similar to classical shear lag behavior. Poisson’s ratio was easily calculated from the ratio of the two pressures and the aspect ratio of the gel specimen. A series of...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011011.
Published Online: February 12, 2008
...,” wherein deformation of the wirebond during the mold process can potentially cause shortcircuiting. Several prior studies have focused on qualifying the effects of various wirebond and mold process parameters on package wiresweep, but most of these studies are restricted to single (discrete) die packages...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 179–189.
Published Online: July 5, 2006
...T. Zhang; S. Rahman; K. K. Choi; K. Cho; P. Baker; M. Shakil; D. Heitkamp This paper presents a global–local methodology for predicting mechanical deformation and fatigue durability of solder joints in electronic packaging systems subject to cyclic thermal loading. It involves a global deformation...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 82–89.
Published Online: May 21, 2006
...Katsuhiko Sasaki; Takuji Kobayashi; Ken-ichi Ohguchi Time-dependent deformations such as creep and ratchetting of solder alloys are significant deformation phenomena that need to be understood to ensure the safety and reliability of solder joints in electronic packaging. There is much research on...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 41–47.
Published Online: May 18, 2006
...Xianjie Yang; Yan Luo; Qing Gao Based on the time dependent multiaxial deformation behavior of 96.5 Sn - 3.5 Ag solder alloy, a constitutive model is proposed which considers the nonproportional multiaxial cyclic deformation properties. In the back stress evolution equations of this model, the...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 71–75.
Published Online: May 12, 2006
...Tadahiro Shibutani; Qiang Yu; Masaki Shiratori As the shrinkage and integration of devices, the creep behavior of tin-based alloys becomes important with microscales. In this paper, the behavior of creep deformation in solder alloys during a nanoindentation test was examined. Nanoindentation creep...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
Published Online: June 3, 2005
... study, thermally induced deformations and warpages of ACF flip chip assemblies as a function of distance from neutral point (DNP) and ACF materials properties were investigated using in situ high sensitivity moire´ interferometry. For a nondestructive failure analysis, scanning acoustic microscopy...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 262–267.
Published Online: June 26, 2004
... vapor pressure induced expanison on the material’s deformation is discussed. 22 06 2004 26 06 2004 electronics packaging micromechanics deformation encapsulation vapour pressure integrated circuit modelling Polymer materials have wide applications in microelectronic...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 237–244.
Published Online: May 26, 2004
... found that the normal deformation significantly affects the fatigue life of the solder joint. Throughout the whole test conditions at room temperature, Sn ∕ 3.5 Ag ∕ 0.75 Cu solder alloy had longer fatigue life than 63 Sn ∕ 37 Pb alloy. Failure patterns of the fatigue tests were observed and discussed...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 115–119.
Published Online: April 30, 2004
... [3] [4] , and Mishkevich and Suhir [5] . However, there still exist some controversies and inconsistencies regarding die stresses, die attach shear and peel stresses, and warpage (deformation) of the assembly. In the study, Suhir’s derivation of the solution is closely examined in details, and the...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 582–588.
Published Online: December 15, 2003
... constitutive relation from Darveaux was used to model the inelastic deformation of the solder alloy, and the different stress-strain responses resulting from different designs were calculated. The analysis results were used to develop the empirical fatigue model based on the interfacial boundary volume damage...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 345–351.
Published Online: December 12, 2002
.... Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 integrated circuit packaging strain measurement deformation thermal expansion measurement displacement measurement atomic force microscopy integrated circuit...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 227–233.
Published Online: July 26, 2002
... soldering wetting surface tension deformation For area-array flip-chip applications, the use of an integrated underfill/solder bump system at the wafer level 1 2 removes the need for subsequent infiltration required by current viscous underfill materials. Unfortunately, the integrated...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 83–87.
Published Online: April 10, 2000
... organic substrate under both loading conditions. Shadow Moire´ technique has been used to measure the out-of-plane residual deformation of the FTV that underwent simulated loading conditions. These components were then visually inspected and tested functionally. Results were summarized and used as...