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Keywords: correlation methods
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Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 8–13.
Published Online: April 30, 2004
... February 2002 30 04 2004 thermal energy storage finite volume methods product design correlation methods Many multi-chip modules such as portable electronic devices have variable power dissipation rates. As a consequence, conventional electronics module coolers must be designed...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 345–351.
Published Online: December 12, 2002
... reliability nondestructive testing correlation methods flip-chip devices image processing crack detection Quality and suitability of thermo-mechanical design and optimization of advanced electronic packages by means of finite element analysis (FEA) to a large extend depends on the data fitted...