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Keywords: ceramic packaging
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041010.
Published Online: November 12, 2009
...Sheng Liu; Wenming Liu; Changyong Lin; Mingxiang Chen A novel ceramic packaging technology by using selective induction heating is presented. Some aspects of this packaging process, including local temperature distribution, hermeticity, tensile strength, and fracture analysis, were tested...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 159–172.
Published Online: April 30, 2004
... ceramic packaging heat transfer nozzles convection Recently, the demand for compactness and higher operational speeds has led to high power density in electronic packages. It is well-known that the failure of electronic components on chips is strongly dependent on the operating temperature...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 313–318.
Published Online: September 17, 2003
... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, December 4, 2001. Associate Editor: B. Courtois. 04 December 2001 17 09 2003 ceramic insulation ceramic packaging semiconductor lasers semiconductor device...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 325–328.
Published Online: September 17, 2003
... into consideration, we explore three ceramic packaging technologies, namely high-temperature co-fired ceramic (HTCC), low-temperature co-fired ceramic (LTCC), and thin-film ceramic technologies. In this paper, we describe some optical MEMS packages designed using these three technologies and discuss their substrate...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 255–261.
Published Online: September 1, 2000
... of creep strain during various stages of temperature cycling loading for “Full Creep” analysis Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associate Technical Editor: Yi-Hsin Pao. ceramic packaging ball grid...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 335–340.
Published Online: March 30, 2000
... 2000 ball grid arrays chip scale packaging ceramic packaging integrated circuit reliability failure analysis life testing environmental testing integrated circuit testing Weibull distribution thermal stress cracking Reliability, irrespective of its definition, is no longer...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 284–289.
Published Online: July 7, 1999
... by the EPPD July 7, 1999. Associate Editor: S. M. Heinrich. 07 July 1999 ceramic packaging ball grid arrays reliability reflow soldering shear strength bending thermal shock fatigue vibrations In recent years, surface mount technology (SMT) has been employed as an advanced...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 172–177.
Published Online: May 21, 1999
... . ceramic capacitors ceramic packaging delamination reliability failure analysis acoustic microscopy ultrasonic materials testing flaw detection thermal stress cracking voids (solid) acoustic tomography Ceramic substrates play an extremely important role in electronic packages. Low...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 168–171.
Published Online: March 15, 1999
...J. Z. Shi; X. M. Xie; F. Stubhan; J. Freytag A novel two-step process based on isothermal solidification is developed for die attachment of ceramic package. With a simple design of the multilayer system, silicon chip could be bonded onto the allumina substrate in between 200°C and 300°C. The total...