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Keywords: aluminium
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Journal Articles
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020901.
Published Online: June 7, 2011
... to the thermal loading than the Al–Cu interface. The thermal loading and mechanical test models proposed here can be used to evaluate interfacial properties under the effects of heat transferring. 24 11 2009 17 01 2011 07 06 2011 07 06 2011 aluminium chromium copper heat transfer...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
Published Online: November 24, 2010
... 24 11 2010 aluminium boundary layers computational fluid dynamics contact resistance convection finite volume methods heat sinks metal foams With the development of new high power-density electronics arises the need for more effective means of dissipating the excess heat...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021003.
Published Online: June 11, 2010
... in such sputtered polycrystalline Al films. 20 08 2009 14 04 2010 11 06 2010 11 06 2010 aluminium electromigration sputtering thin film circuits EM high purity Al film grain boundary diffusion AFD activation energy Thin films, which are thin material layers ranging...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
Published Online: March 27, 2009
... properties. 21 11 2007 07 01 2009 27 03 2009 aluminium computational fluid dynamics finite volume methods forced convection heat conduction heat sinks metal foams stratified flow thermal conductivity With the advent of higher performing computer chips arises the need...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
... analysis atomic force microscopy focused ion beam technology eutectic alloys lead alloys tin alloys aluminium zincation electroless nickel immersion gold (ENIG) under bump metallurgy (UBM) Electroless nickel immersion gold (ENIG) for under bump metallurgy (UBM) is gaining interest...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 192–201.
Published Online: November 23, 2005
... metallisation materials testing shear deformation nucleation ductile fracture mechanical testing voids (solid) gold copper aluminium fractography shear fracture gold ball bond copper ball bond thermosonic bonding interface In integrated circuit (IC) chip manufacturing, wire bonding...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 259–266.
Published Online: September 23, 2005
... configuration for even larger enhancement in heat transfer. 25 05 2005 23 09 2005 heat sinks cooling electronics packaging convection porous materials metal foams aluminium Horton , C. W. , and Rogers , F. T. , 1945 , “ Convection Currents in Porous Media ,” J. Appl...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... and Photonic Pacaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received August 3, 2003; revision received June 13, 2004. Review conducted by: P. Lall. 03 August 2003 13 June 2004 03 06 2005 silicon conducting polymers polymer films aluminium...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 342–350.
Published Online: October 6, 2004
... 01 Feb 2004 06 10 2004 heat sinks flow through porous media permeability aluminium convection Today’s trend in the electronic equipment industry toward denser and more powerful products requires a higher level of performance from cooling technology. Many ideas for cooling...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 202–207.
Published Online: July 8, 2004
... devices polymers dielectric materials fracture delamination thermal stress cracking aluminium silicon Flip chip bonding technology using anisotropic conductive films (ACFs) has been used for decades in the area LCD display applications. In recent, there has been growing interest in using...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 247–255.
Published Online: July 8, 2004
... permeability flow simulation aluminium temperature distribution The trend in electronics industry toward smaller and more powerful products has increased power density of electronic components, as shown in Fig. 1 . For reliable operation of these products, thermal modeling and design of electronic...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 223–234.
Published Online: May 8, 2004
... 08 05 2004 heat conduction porous materials aluminium foams air forced convection heat sinks modelling flow through porous media Porous Metallic Foam Heat Sink Single Blow Method Transient Liquid Crystal Method Nusselt Number Reynolds Number The analysis of heat...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 597–601.
Published Online: December 15, 2003
... 2003 fine-pitch technology soldering flip-chip devices integrated circuit interconnections integrated circuit packaging aluminium microassembling Since the inception of C4 (controlled collapse chip connection) technology by IBM for their solid logic technology (SLT) more than 40...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 617–620.
Published Online: December 15, 2003
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received February 2003. Associate Editor: E. Suhir. 01 February 2003 15 12 2003 gold copper aluminium integrated circuit interconnections integrated circuit packaging integrated circuit reliability ageing lead bonding hardness...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 155–163.
Published Online: July 26, 2002
...) forced convection thermal resistance foams porous materials flow through porous media boundary layers cooling aluminium The large-scale integration of electronic circuits has resulted in a continuous increase in chip power dissipation requirements. According to the SIA roadmap 1...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. June 2002, 124(2): 127–134.
Published Online: May 2, 2002
...: A. Rafanelli. 16 April 2001 02 05 2002 packaging rough surfaces fracture toughness fracture mechanics failure analysis reliability interface roughness polymers cracks surface topography metals flip-chip devices adhesion aluminium Polymer adhesives are widely used...