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Keywords: Wirebond
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031009.
Paper No: EP-17-1113
Published Online: July 2, 2018
... in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 22, 2017; final manuscript received June 3, 2018; published online July 2, 2018. Assoc. Editor: Satish Chaparala. 22 10 2017 03 06 2018 Flexible circuits Power packaging Reliability Wirebond Silicon...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041010.
Paper No: EP-17-1026
Published Online: October 25, 2017
... Flip chip High density interconnects Power packaging Wirebond In general, microjoining within electronics packages can be classified into three types: wire bonding (WB), tape automated bonding (TAB), and flip chip bonding (FCB) [ 1 ]. TAB was an excellent technology as a tape carrier method...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041002.
Paper No: EP-17-1042
Published Online: July 27, 2017
... Wirebond Driven by the demand for smarter and faster portable electronic products, the advanced semiconductor packaging technology is targeting to integrate multiple and heterogeneous dies or chips. There are many types of three-dimensional (3D) stacking configurations and interconnection...
Topics: Wire, Deflection
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
Published Online: July 14, 2017
... layouts. Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill Wirebond 30 01 2017 31 05 2017 Contributed by the Electronic and Photonic Packaging Division...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041004.
Paper No: EP-14-1080
Published Online: October 1, 2015
... BGA Wirebond The semiconductor packaging industry is constantly heading toward small and thin products with a high density of input/output (I/O) counts. At present, BGA technology is one of the leading edge technologies in surface mount manufacturing techniques. Most of the home electronic...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. December 2014, 136(4): 040801.
Paper No: EP-14-1068
Published Online: October 15, 2014
..., the state-of-the-art, challenge, and trend of 3D integration will be presented and examined. Furthermore, supply chain readiness for high volume manufacturing (HVM) of TSVs is discussed. 3D packaging Micro vias Microsystems Underfill Wirebond The Electronics Industry has been the largest...